1SG280HU2F50E1VGS3

The 1SG280HU2F50E1VGS3 is a Stratix® 10 GX field programmable gate array (FPGA) packaged in a 2397-BBGA FCBGA. Built for high-density logic and extensive I/O, this device targets advanced applications that require high logic capacity, large on-chip RAM, and a broad I/O complement.

Featuring the Stratix 10 family architecture, the device combines high logic element count, substantial embedded RAM, and support for high-speed transceiver capabilities at the family level to enable demanding communications, compute and signal-processing designs.

Key Features

• Logic Capacity  Provides 2,800,000 logic elements to implement large-scale digital designs and complex algorithms.
• On-chip Memory  Includes 240,123,904 bits of embedded RAM for large buffering, packet handling, and state storage.
• I/O Density  Offers 704 I/O pins to support wide parallel buses, multiple interfaces, and high connector counts.
• Package & Mounting  Ships in a 2397-BBGA (FCBGA) package designed for surface-mount PCB assembly; supplier package listed as 2397-FBGA, FC (50×50).
• Power Supply  Operates from a core voltage supply range of 770 mV to 970 mV to match system power architectures.
• Operating Range  Specified for operation from 0 °C to 100 °C and supplied in an Extended grade.
• Family-level Innovations  The Stratix 10 family introduces the Intel Hyperflex™ core architecture, Intel 14 nm tri-gate (FinFET) technology, and heterogeneous 3D SiP transceiver tiles as documented for the device family.
• High-speed Serial and Protocol Support (family)  Family features include transceiver data rates up to 28.3 Gbps, hard PCI Express Gen3 IP, and 10G/40G Ethernet hard IP in transceiver channels as described in the device family overview.
• Compliance  RoHS compliant.

Typical Applications

• High-performance networking  Use the device where large logic capacity and high I/O counts are required for switch, router, and line-card designs.
• Data center acceleration  Deploy for compute acceleration, packet processing, and offload functions that leverage extensive on-chip RAM and high logic density.
• Signal processing  Apply in DSP and packet-processing systems that need large memory buffers and abundant logic resources.
• Test and measurement  Suitable for instruments that require deterministic, programmable logic and high-channel I/O support.

Unique Advantages

• High logic scale: 2,800,000 logic elements enable integration of complex, multi-function designs into a single device, reducing system BOM and board space.
• Large on-chip RAM: 240,123,904 bits of embedded RAM support deep buffering and efficient in-hardware data handling for latency-sensitive tasks.
• Extensive I/O connectivity: 704 I/O pins provide flexibility to interface with multiple parallel buses, memory interfaces, and peripheral systems without external multiplexing.
• Production-ready package: 2397-BBGA FCBGA surface-mount package facilitates high-density PCB integration and reliable assembly processes.
• Family-level high-speed features: Access to Stratix 10 family innovations—including Hyperflex architecture and high-speed transceiver capabilities—enables designs that require high throughput and advanced protocol support.
• RoHS compliant and extended grade: Meets environmental compliance requirements and is specified for extended-temperature operation to align with a range of system environments.

Why Choose 1SG280HU2F50E1VGS3?

This Stratix 10 GX device brings together high logic element count, substantial embedded RAM, and a large I/O complement in a production-ready 2397-BBGA package. It is well suited for designers building high-throughput communications, compute acceleration, and advanced signal-processing systems that benefit from dense programmable fabric and extensive memory resources.

Choosing this device provides scalability within the Stratix 10 family, enabling designs that can leverage family-level innovations such as the Hyperflex core architecture and high-speed transceiver capabilities while maintaining clear, verifiable device-level specifications for power, thermal range, and package.

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