1SG280HU2F50E1VG

The 1SG280HU2F50E1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2397-BBGA FCBGA package. It delivers very high logic density and embedded memory capacity for demanding digital designs.

Built on the Stratix 10 family architecture, this device targets high-bandwidth, high-performance applications where large on-chip RAM, extensive I/O, and advanced core architecture provide system-level integration and performance efficiency.

Key Features

• Core Architecture – Part of the Stratix 10 GX family and based on the Intel Hyperflex core architecture described for the family, offering enhanced core performance.
• Logic Capacity – 2,800,000 logic elements for large-scale logic implementation and complex design mapping.
• Embedded Memory – 240,123,904 total RAM bits to support large buffers, FIFOs, and on-chip data storage.
• I/O Density – 704 I/O pins to support broad external interfacing and multi-lane connectivity.
• Voltage Supply – Operates across a core voltage range of 770 mV to 970 mV for power domain planning.
• Temperature Range – Rated for operation from 0 °C to 100 °C (extended grade) to match a wide range of system environments.
• Package & Mounting – 2397-BBGA (FCBGA, 50 × 50) surface-mount package suitable for high-density board designs.
• Family-Level Innovations – The Stratix 10 family overview highlights features such as heterogeneous 3D SiP transceiver tiles, fractional synthesis PLLs, hard IP blocks, and advanced DSP blocks that are characteristic of the device family.
• RoHS Compliance – RoHS-compliant material status for environmental regulatory considerations.

Typical Applications

• High-bandwidth Networking: Use the device’s large logic capacity and extensive I/O to implement packet processing, switching fabrics, and multi-port network interfaces.
• Data Center Acceleration: Deploy the FPGA for hardware acceleration tasks where on-chip RAM and logic density enable large-scale data paths and buffering.
• Signal Processing and DSP: Leverage the Stratix 10 family’s DSP-oriented architecture and high memory capacity for real-time signal chain implementations.
• Telecommunications and Backplane Systems: Support complex protocol handling and lane aggregation using the device’s high I/O count and family transceiver capabilities.

Unique Advantages

• High Logic Density: 2,800,000 logic elements enable implementation of large RTL designs and deep pipelining without external logic.
• Substantial On-Chip Memory: 240,123,904 bits of RAM reduce dependence on external memory for buffering and state storage.
• Extensive I/O Count: 704 I/Os simplify system partitioning and direct interfacing to multiple high-speed peripherals.
• Extended Operating Range: 0 °C to 100 °C rating supports a broad set of deployment environments.
• Robust Packaging: 2397-BBGA FCBGA surface-mount package supports high-density board layouts and thermal integration.
• Family-Level Performance Features: Benefits from Stratix 10 family innovations—such as Hyperflex architecture and advanced PLLs—documented in the device overview.

Why Choose 1SG280HU2F50E1VG?

The 1SG280HU2F50E1VG positions itself for designs that require very high logic density, large embedded RAM, and significant I/O capability in a single FPGA package. Its extended-grade temperature rating and surface-mount 2397-BBGA form factor make it suitable for compact, high-performance systems.

For engineering teams implementing complex networking, compute acceleration, or signal processing tasks, this Stratix 10 GX device delivers the on-chip resources and family-level architectural features needed to integrate functionality, reduce board-level complexity, and scale designs within the Intel Stratix 10 ecosystem.

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