1SG280HU1F50I2LG

The 1SG280HU1F50I2LG is an Intel Stratix® 10 GX family FPGA in a 2397-BBGA FCBGA package, designed for high-density, high-throughput FPGA applications. It pairs a large programmable fabric with extensive on-chip memory and a broad I/O count to address demanding tasks in networking, data center, and high-speed signal processing applications.

Built on the Stratix 10 series architecture, the device benefits from series-level innovations such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology to deliver advanced performance and power characteristics for complex system designs.

Key Features

• High-density programmable fabric — 2,800,000 logic elements to implement large, complex logic designs and accelerate compute-intensive functions.
• On-chip memory — 240,123,904 total RAM bits for large buffering, data staging, and on-chip storage.
• Extensive I/O — 704 I/O pins to support wide external interfaces, parallel buses, and high-pin-count system connectivity.
• Series-level architecture — Incorporates Intel Hyperflex core architecture and 14 nm FinFET technology as described for the Stratix 10 GX family, delivering the series’ performance and efficiency advantages.
• Power supply — Core supply voltage range 820 mV to 880 mV to match platform power-rail requirements.
• Package and mounting — 2397-BBGA, FCBGA package; supplier device package specified as 2397-FBGA, FC (50×50); surface mount mounting for automated assembly.
• Industrial temperature rating — Operating temperature range −40 °C to 100 °C suitable for industrial environments.
• Environmental compliance — RoHS compliant.

Typical Applications

• High-performance networking and telecom — Leverage the large logic capacity and series-level transceiver capabilities for packet processing, line cards, and protocol acceleration.
• Data center acceleration — Use the dense fabric and large on-chip RAM for compute offload, custom acceleration, and low-latency data-path implementations.
• High-speed I/O and backplane systems — 704 I/O pins and the Stratix 10 series’ high-speed connectivity features support complex backplane and modular system designs.
• Signal processing and DSP — Large logic and memory resources enable implementation of advanced DSP pipelines, real-time processing, and large buffering requirements.

Unique Advantages

• High logic capacity: 2.8M logic elements provide headroom for large-scale FPGA designs without immediately moving to multi-device implementations.
• Substantial on-chip RAM: 240,123,904 bits of RAM reduce external memory dependence for many buffering and staging tasks, simplifying board-level design.
• Broad I/O capability: 704 I/O pins allow flexible partitioning between high-speed links and parallel interfaces, supporting diverse system requirements.
• Industrial robustness: −40 °C to 100 °C operating range and surface-mount BBGA packaging support deployment in demanding industrial environments.
• Low-voltage core operation: 0.82–0.88 V core supply range aids in power-rail planning for high-density FPGA implementations.
• Regulatory and assembly-ready: RoHS compliance and standard FCBGA packaging facilitate regulatory alignment and automated PCB assembly.

Why Choose 1SG280HU1F50I2LG?

The 1SG280HU1F50I2LG positions itself as a high-density Stratix 10 GX FPGA option for engineers who require a combination of large programmable fabric, substantial on-chip memory, and extensive I/O in an industrial-grade package. Its specification set makes it suitable for applications that demand significant logic resources, robust I/O capability, and industrial temperature operation.

Choosing this device provides a clear path to implement complex, high-throughput designs while leveraging the Stratix 10 series’ architectural benefits. The device’s packaging and supply characteristics simplify integration into automated manufacturing flows and industrial systems.

Request a quote or submit a product inquiry to receive pricing, availability, and technical assistance for the 1SG280HU1F50I2LG. Our team can help evaluate fit for your design and provide lead-time and ordering information.