1SG280HU1F50I1VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2800000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 1,503 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 704 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280HU1F50I1VG – Stratix® 10 GX FPGA IC, 2,800,000 logic elements
The 1SG280HU1F50I1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) offered in a 2397‑ball FCBGA package for surface mount assembly. It delivers a high-density programmable fabric with 2,800,000 logic elements and large on‑chip memory to address advanced bandwidth and processing workloads.
Built on the Stratix 10 GX family architecture, this device targets high‑performance communications, networking, compute acceleration and industrial applications that require extensive I/O, large RAM capacity and scalable programmable logic.
Key Features
- Core & architecture — Stratix 10 GX family architecture with Intel Hyperflex core innovations described for the device family to deliver increased core performance.
- Logic density — 2,800,000 logic elements (LEs) to implement large, complex designs and high‑logic counts on a single device.
- On‑chip memory — 240,123,904 total RAM bits of embedded memory for buffering, lookup tables and intermediate data storage.
- I/O and packaging — 704 I/O pins and a 2397‑ball BBGA/FCBGA package (supplier package: 2397‑FBGA, FC 50×50) in a surface mount form factor.
- Transceiver and connectivity (family level) — Stratix 10 GX family documentation describes heterogeneous 3D SiP transceiver tiles and transceiver data rates up to 28.3 Gbps for high‑bandwidth chip‑to‑chip and backplane links.
- Power supply range — Core supply operating range from 770 mV to 970 mV to match system power architectures.
- Operating temperature — Industrial temperature grade with a specified range of −40 °C to 100 °C for deployment in industrial and harsh environmental conditions.
- Family‑level system features — Stratix 10 family documentation highlights FPGA innovations such as fractional synthesis PLLs, variable precision DSP blocks and hard IP (PCIe, Ethernet) available within the device family.
- Standards & compliance — RoHS‑compliant manufacturing as noted in the product data.
Typical Applications
- High‑performance networking: Implements packet processing, switching and line‑rate interfaces using large logic capacity and high‑speed transceivers described in the Stratix 10 GX family.
- Data center acceleration: Offloads compute‑intensive functions and custom accelerators using abundant logic elements and on‑chip RAM.
- Telecommunications and optical transport: Supports high‑bandwidth links and protocol processing leveraging family transceiver capabilities and large programmable fabric.
- Industrial control and automation: Enables complex control algorithms and sensor aggregation within an industrial temperature range (−40 °C to 100 °C).
Unique Advantages
- Massive programmable capacity: 2.8 million logic elements provide the headroom to integrate large functions and reduce the need for multi‑chip solutions.
- Large on‑chip memory: 240,123,904 total RAM bits enable substantial buffering and stateful processing without external memory dependencies.
- Extensive I/O: 704 I/O pins in a compact FCBGA package facilitate dense system interfaces and board-level routing options.
- Industrial temperature support: Specified for −40 °C to 100 °C operation to meet industrial deployment requirements.
- Controlled core power range: Core voltage support from 770 mV to 970 mV allows design flexibility for power and performance tradeoffs.
- RoHS compliant: Manufactured to RoHS standards for environmental compliance in commercial and industrial products.
Why Choose 1SG280HU1F50I1VG?
The 1SG280HU1F50I1VG positions itself as a high‑density Stratix 10 GX FPGA option for designers who require substantial programmable logic, large on‑chip RAM and broad I/O in an industrial temperature‑rated package. Its combination of 2.8 million logic elements, 240 million bits of RAM and 704 I/O makes it suitable for demanding networking, compute acceleration and industrial control applications.
Choosing this device lets teams consolidate complex functions onto a single FPGA, leverage family‑level high‑speed connectivity and integrate into systems that require surface‑mount FCBGA packaging and industrial temperature performance.
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