1SG280HU1F50E2LGS3
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2800000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 645 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 704 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280HU1F50E2LGS3 – Stratix® 10 GX FPGA, 2,800,000 logic elements, 704 I/O, 2397-BBGA
The 1SG280HU1F50E2LGS3 is an Intel Stratix® 10 GX field programmable gate array (FPGA) provided in a 2397-BBGA (FCBGA) package. It combines very high logic density with extensive I/O to address advanced, high-bandwidth processing applications.
Built on the Stratix 10 family architecture, the device takes advantage of family-level innovations such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process to deliver the performance and power characteristics required by demanding communications, compute and networking designs.
Key Features
- Core architecture Intel Stratix 10 family Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process are part of the device family documentation, providing the foundational performance and power advantages described for Stratix 10 devices.
- Logic capacity 2,800,000 logic elements (LEs) for implementing large-scale programmable logic and complex custom hardware functions.
- On-chip memory 240,123,904 total RAM bits of embedded memory to support large buffering, lookup tables and state storage within the FPGA fabric.
- I/O and high-speed interfaces 704 I/O pins support wide external connectivity. Stratix 10 family documentation also describes high-speed transceiver capabilities available in GX devices.
- Hard IP and DSP (family-level) Family documentation highlights hard IP such as PCI Express and high-performance variable-precision DSP blocks for compute acceleration (refer to family documentation for available hard IP options).
- Power supply Supported core voltage supply range of 820 mV to 880 mV, enabling integration with low-voltage power architectures.
- Package and mounting 2397-BBGA (FCBGA) package; supplier device package listed as 2397-FBGA, FC (50 × 50). Surface-mount device for standard board assembly processes.
- Operating range and grade Extended grade device with an operating temperature range of 0 °C to 100 °C.
- Environmental compliance RoHS compliant.
Typical Applications
- High-performance networking Use the device to implement packet processing, switching, and line-card logic where large logic capacity and extensive I/O are required.
- Data center acceleration Implement custom accelerators and FPGA offload engines that benefit from large on-chip memory and high logic density.
- Telecommunications infrastructure Deploy in systems requiring high bandwidth and programmable protocol handling, leveraging family transceiver and hard-IP capabilities.
- High-speed test and measurement Create flexible, high-channel-count data acquisition and signal processing systems using abundant logic and I/O resources.
Unique Advantages
- High logic density: 2.8 million logic elements enable large designs on a single device, reducing the need for multi-FPGA partitioning.
- Substantial embedded memory: 240,123,904 bits of on-chip RAM provide capacity for buffering, large lookup tables and state retention within the fabric.
- Extensive I/O: 704 I/O pins allow broad external connectivity for multi-lane interfaces, parallel buses, and high-channel-count designs.
- Low-voltage core operation: 820–880 mV core voltage support helps integrate the FPGA into low-voltage power systems.
- Extended operating range: 0 °C to 100 °C rating and Extended grade designation support deployment in many commercial and industrial environments.
- Family-level performance and power innovations: Stratix 10 family features like the Hyperflex architecture and 14 nm FinFET process deliver the performance and efficiency characteristics documented for the series.
Why Choose 1SG280HU1F50E2LGS3?
The 1SG280HU1F50E2LGS3 positions itself as a high-capacity Stratix 10 GX FPGA option for designs that need large programmable logic, significant on-chip memory and broad external connectivity. Its package and electrical characteristics make it suitable for advanced networking, compute acceleration and high-performance signal processing applications where board-level density and integration matter.
Choosing this device provides designers with the Stratix 10 family architecture and its documented innovations, combined with explicit device-level resources — logic elements, RAM capacity, I/O count, and defined operating and supply ranges — to plan and scale complex FPGA-based systems with confidence.
Request a quote or submit an inquiry to check availability and receive pricing and lead-time information for the 1SG280HU1F50E2LGS3.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018