1SG280HU1F50E2LGS3

IC FPGA 704 I/O 2397FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2800000 2397-BBGA, FCBGA

Quantity 645 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O704Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SG280HU1F50E2LGS3 – Stratix® 10 GX FPGA, 2,800,000 logic elements, 704 I/O, 2397-BBGA

The 1SG280HU1F50E2LGS3 is an Intel Stratix® 10 GX field programmable gate array (FPGA) provided in a 2397-BBGA (FCBGA) package. It combines very high logic density with extensive I/O to address advanced, high-bandwidth processing applications.

Built on the Stratix 10 family architecture, the device takes advantage of family-level innovations such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process to deliver the performance and power characteristics required by demanding communications, compute and networking designs.

Key Features

  • Core architecture  Intel Stratix 10 family Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process are part of the device family documentation, providing the foundational performance and power advantages described for Stratix 10 devices.
  • Logic capacity  2,800,000 logic elements (LEs) for implementing large-scale programmable logic and complex custom hardware functions.
  • On-chip memory  240,123,904 total RAM bits of embedded memory to support large buffering, lookup tables and state storage within the FPGA fabric.
  • I/O and high-speed interfaces  704 I/O pins support wide external connectivity. Stratix 10 family documentation also describes high-speed transceiver capabilities available in GX devices.
  • Hard IP and DSP (family-level)  Family documentation highlights hard IP such as PCI Express and high-performance variable-precision DSP blocks for compute acceleration (refer to family documentation for available hard IP options).
  • Power supply  Supported core voltage supply range of 820 mV to 880 mV, enabling integration with low-voltage power architectures.
  • Package and mounting  2397-BBGA (FCBGA) package; supplier device package listed as 2397-FBGA, FC (50 × 50). Surface-mount device for standard board assembly processes.
  • Operating range and grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.
  • Environmental compliance  RoHS compliant.

Typical Applications

  • High-performance networking  Use the device to implement packet processing, switching, and line-card logic where large logic capacity and extensive I/O are required.
  • Data center acceleration  Implement custom accelerators and FPGA offload engines that benefit from large on-chip memory and high logic density.
  • Telecommunications infrastructure  Deploy in systems requiring high bandwidth and programmable protocol handling, leveraging family transceiver and hard-IP capabilities.
  • High-speed test and measurement  Create flexible, high-channel-count data acquisition and signal processing systems using abundant logic and I/O resources.

Unique Advantages

  • High logic density: 2.8 million logic elements enable large designs on a single device, reducing the need for multi-FPGA partitioning.
  • Substantial embedded memory: 240,123,904 bits of on-chip RAM provide capacity for buffering, large lookup tables and state retention within the fabric.
  • Extensive I/O: 704 I/O pins allow broad external connectivity for multi-lane interfaces, parallel buses, and high-channel-count designs.
  • Low-voltage core operation: 820–880 mV core voltage support helps integrate the FPGA into low-voltage power systems.
  • Extended operating range: 0 °C to 100 °C rating and Extended grade designation support deployment in many commercial and industrial environments.
  • Family-level performance and power innovations: Stratix 10 family features like the Hyperflex architecture and 14 nm FinFET process deliver the performance and efficiency characteristics documented for the series.

Why Choose 1SG280HU1F50E2LGS3?

The 1SG280HU1F50E2LGS3 positions itself as a high-capacity Stratix 10 GX FPGA option for designs that need large programmable logic, significant on-chip memory and broad external connectivity. Its package and electrical characteristics make it suitable for advanced networking, compute acceleration and high-performance signal processing applications where board-level density and integration matter.

Choosing this device provides designers with the Stratix 10 family architecture and its documented innovations, combined with explicit device-level resources — logic elements, RAM capacity, I/O count, and defined operating and supply ranges — to plan and scale complex FPGA-based systems with confidence.

Request a quote or submit an inquiry to check availability and receive pricing and lead-time information for the 1SG280HU1F50E2LGS3.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up