1SG280HN3F43I3XG

The 1SG280HN3F43I3XG is an Intel Stratix® 10 GX field programmable gate array in a 1760-BBGA (FCBGA) package. It delivers a large logic fabric and high I/O density for demanding industrial applications that require substantial on-chip logic, memory, and interface capability.

Built on the Stratix 10 family architecture, this device benefits from family-level innovations such as the Intel Hyperflex™ core architecture and advanced 14 nm FinFET process technology, providing a platform suited for high-performance signal processing, networking, and compute-accelerated designs.

Key Features

• Logic Capacity  2,800,000 logic elements to implement large-scale digital designs and complex algorithms.
• On‑chip Memory  240,123,904 total RAM bits for buffering, packet buffering, and data staging without external memory in many use cases.
• High I/O Density  688 user I/O pins supporting extensive peripheral and high-speed interface connectivity.
• Package & Mounting  1760-BBGA (FCBGA) supplier package (1760-FBGA, 42.5 × 42.5 mm); surface-mount device for board-level assembly.
• Industrial Temperature Range  Specified for −40 °C to 100 °C operation to meet industrial environment requirements.
• Core Voltage Range  Core supply specified between 820 mV and 880 mV for system power planning.
• RoHS Compliant  Meets RoHS environmental requirements.
• Stratix 10 Family Innovations  Family-level capabilities include the Intel Hyperflex core architecture, 14 nm tri‑gate (FinFET) technology, heterogeneous 3D SiP transceiver tiles, high‑performance transceivers, on‑die M20K SRAM blocks, fractional synthesis and low‑jitter PLL options, and hard IP for interfaces such as PCI Express and 10G Ethernet (as described in the Stratix 10 GX/SX device overview).

Typical Applications

• High‑performance Networking  Use the device’s logic density, on‑chip memory, and high I/O count for packet processing, switch fabrics, and line-rate protocol offload.
• Telecommunications Infrastructure  Deploy as a programmable accelerator or protocol bridge in baseband, fronthaul/backhaul, and transport systems.
• Data Center Acceleration  Implement compute‑intensive kernels and custom accelerators that leverage large logic capacity and substantial on‑chip RAM.
• Industrial Control & Automation  Leverage the industrial temperature rating and high I/O count for complex control, sensor aggregation, and real‑time processing tasks.

Unique Advantages

• Massive Logic Resources: 2.8 million logic elements enable implementation of large, integrated systems on a single device, reducing board-level complexity.
• Large On‑Chip Memory: Over 240 million bits of RAM reduce reliance on external memory for buffering and datapath storage, simplifying system design and lowering latency.
• High I/O Count: 688 I/Os support dense peripheral connectivity and multiple high-speed interfaces without additional bridge devices.
• Industrial Reliability: Specified operation from −40 °C to 100 °C addresses thermal demands of industrial deployments.
• Advanced Package for Dense Designs: 1760‑ball FCBGA package (42.5 × 42.5 mm) provides high pin count in a compact footprint for space-constrained systems.
• Family-Level High-Performance Building Blocks: Access to Stratix 10 GX family innovations—Hyperflex architecture, FinFET process, and transceiver/IP options—enables scalable performance and integration when designing to family capabilities.

Why Choose 1SG280HN3F43I3XG?

This Stratix 10 GX device combines extensive logic capacity, large on‑chip RAM, and a high I/O count in an industrial‑rated FPGA package, making it a fit for complex, high-throughput systems where integration and performance matter. Designers targeting networking, telecom, data center acceleration, or industrial control can consolidate functionality onto a single programmable device to reduce board complexity and improve system determinism.

Being part of the Stratix 10 family, the device inherits proven family-level architectural innovations such as the Hyperflex core and 14 nm FinFET technology, supporting designs that require scalable compute, configurable interfaces, and advanced timing/power tradeoffs. The combination of technical capability and industrial temperature support offers a long-term platform for robust, high-performance designs.

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