1SG280HN3F43I2LG

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA

Quantity 833 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SG280HN3F43I2LG – Stratix® 10 GX Field Programmable Gate Array (1760-BBGA)

The 1SG280HN3F43I2LG is an Intel Stratix® 10 GX FPGA supplied in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package. It leverages the Stratix 10 family architecture to deliver high core performance and energy efficiency for advanced, high-bandwidth processing applications.

With 2,800,000 logic elements, extensive on-chip RAM and high-speed I/O, this industrial-grade device is targeted at system designs that require dense logic capacity, large embedded memory, and robust I/O connectivity within an extended operating temperature range.

Key Features

  • Core architecture and performance  Built on the Intel Stratix 10 family technology, featuring the Intel Hyperflex™ core architecture and 14 nm tri-gate process; designed to deliver increased core performance and reduced power versus prior generations.
  • Large logic capacity  2,800,000 logic elements provide substantial programmable fabric for complex logic and custom system functions.
  • On-chip memory  240,123,904 total RAM bits of embedded memory, with support for M20K internal SRAM memory block structures for efficient data buffering and local storage.
  • Variable-precision DSP  Family-level DSP resources support variable precision compute, enabling high-throughput signal processing workloads.
  • High-speed transceivers and connectivity  Stratix 10 family devices include heterogeneous 3D SiP transceiver tiles and transceiver performance up to 28.3 Gbps chip-to-chip/module and backplane; family-level hard IP includes PCI Express Gen3 x16 and 10G Ethernet FEC in transceiver channels.
  • I/O density  688 I/O pins provide broad external connectivity for complex system interfaces and board-level integration.
  • Power and supply  Core voltage supply range of 820 mV to 880 mV with on-chip power management features described in the Stratix 10 device family documentation.
  • Package and mounting  1760-BBGA (FCBGA) surface-mount package; supplier device package listed as 1760-FBGA (42.5 × 42.5 mm).
  • Industrial temperature range  Rated for operation from −40°C to 100°C and RoHS compliant for environmental compatibility.

Typical Applications

  • High-performance networking and telecom  Line cards, switches and routers that require dense programmable logic and high-speed transceiver channels for bandwidth-intensive traffic.
  • Data center acceleration  Compute acceleration and high-throughput data processing where large logic capacity and on-chip memory enable custom acceleration kernels and DSP workloads.
  • High-speed I/O systems  Backplane and module designs leveraging PCI Express Gen3 and multi-gigabit transceiver performance for connectivity and board-to-board links.
  • Industrial and rugged systems  Control, monitoring and processing applications that benefit from industrial temperature rating, extensive I/O and high logic density.

Unique Advantages

  • Massive programmable capacity: 2,800,000 logic elements enable implementation of large-scale, complex designs without partitioning across multiple devices.
  • Extensive embedded memory: 240,123,904 total RAM bits provide ample on-chip storage for buffering, packet processing and data-centric workloads.
  • High-speed connectivity: Family-level support for high-rate transceivers and hard PCIe/ethernet IP simplifies integration of high-bandwidth links and backplane interfaces.
  • Industrial temperature range: Rated −40°C to 100°C, making the device suitable for a wide range of harsh-environment deployments.
  • Compact high-pin package: 1760-BBGA surface-mount package combines high I/O count (688) and large logic resources in a single, board-friendly footprint.

Why Choose 1SG280HN3F43I2LG?

The 1SG280HN3F43I2LG positions Stratix 10 GX family capabilities in a single, industrial-grade FPGA package optimized for demanding, high-bandwidth system designs. Its combination of millions of logic elements, large embedded RAM, abundant I/O and family-level transceiver and hard-IP capabilities make it a strong fit for applications that require both compute density and extensive external connectivity.

Designed for engineers building advanced networking, data center acceleration and industrial processing systems, this device offers scalability within the Stratix 10 family and leverages Intel's documented architecture and tool ecosystem to support development and long-term deployment.

Request a quote or submit an inquiry to start the procurement process for 1SG280HN3F43I2LG and receive pricing and availability details.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up