1SG280HN3F43I2LG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 833 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280HN3F43I2LG – Stratix® 10 GX Field Programmable Gate Array (1760-BBGA)
The 1SG280HN3F43I2LG is an Intel Stratix® 10 GX FPGA supplied in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package. It leverages the Stratix 10 family architecture to deliver high core performance and energy efficiency for advanced, high-bandwidth processing applications.
With 2,800,000 logic elements, extensive on-chip RAM and high-speed I/O, this industrial-grade device is targeted at system designs that require dense logic capacity, large embedded memory, and robust I/O connectivity within an extended operating temperature range.
Key Features
- Core architecture and performance Built on the Intel Stratix 10 family technology, featuring the Intel Hyperflex™ core architecture and 14 nm tri-gate process; designed to deliver increased core performance and reduced power versus prior generations.
- Large logic capacity 2,800,000 logic elements provide substantial programmable fabric for complex logic and custom system functions.
- On-chip memory 240,123,904 total RAM bits of embedded memory, with support for M20K internal SRAM memory block structures for efficient data buffering and local storage.
- Variable-precision DSP Family-level DSP resources support variable precision compute, enabling high-throughput signal processing workloads.
- High-speed transceivers and connectivity Stratix 10 family devices include heterogeneous 3D SiP transceiver tiles and transceiver performance up to 28.3 Gbps chip-to-chip/module and backplane; family-level hard IP includes PCI Express Gen3 x16 and 10G Ethernet FEC in transceiver channels.
- I/O density 688 I/O pins provide broad external connectivity for complex system interfaces and board-level integration.
- Power and supply Core voltage supply range of 820 mV to 880 mV with on-chip power management features described in the Stratix 10 device family documentation.
- Package and mounting 1760-BBGA (FCBGA) surface-mount package; supplier device package listed as 1760-FBGA (42.5 × 42.5 mm).
- Industrial temperature range Rated for operation from −40°C to 100°C and RoHS compliant for environmental compatibility.
Typical Applications
- High-performance networking and telecom Line cards, switches and routers that require dense programmable logic and high-speed transceiver channels for bandwidth-intensive traffic.
- Data center acceleration Compute acceleration and high-throughput data processing where large logic capacity and on-chip memory enable custom acceleration kernels and DSP workloads.
- High-speed I/O systems Backplane and module designs leveraging PCI Express Gen3 and multi-gigabit transceiver performance for connectivity and board-to-board links.
- Industrial and rugged systems Control, monitoring and processing applications that benefit from industrial temperature rating, extensive I/O and high logic density.
Unique Advantages
- Massive programmable capacity: 2,800,000 logic elements enable implementation of large-scale, complex designs without partitioning across multiple devices.
- Extensive embedded memory: 240,123,904 total RAM bits provide ample on-chip storage for buffering, packet processing and data-centric workloads.
- High-speed connectivity: Family-level support for high-rate transceivers and hard PCIe/ethernet IP simplifies integration of high-bandwidth links and backplane interfaces.
- Industrial temperature range: Rated −40°C to 100°C, making the device suitable for a wide range of harsh-environment deployments.
- Compact high-pin package: 1760-BBGA surface-mount package combines high I/O count (688) and large logic resources in a single, board-friendly footprint.
Why Choose 1SG280HN3F43I2LG?
The 1SG280HN3F43I2LG positions Stratix 10 GX family capabilities in a single, industrial-grade FPGA package optimized for demanding, high-bandwidth system designs. Its combination of millions of logic elements, large embedded RAM, abundant I/O and family-level transceiver and hard-IP capabilities make it a strong fit for applications that require both compute density and extensive external connectivity.
Designed for engineers building advanced networking, data center acceleration and industrial processing systems, this device offers scalability within the Stratix 10 family and leverages Intel's documented architecture and tool ecosystem to support development and long-term deployment.
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