1SG280HN3F43E3VGS3

The 1SG280HN3F43E3VGS3 is an Intel Stratix® 10 GX field programmable gate array (FPGA) device delivering 2,800,000 logic elements and a high on‑chip RAM capacity. Built on the Stratix® 10 GX family architecture, it targets advanced, bandwidth- and compute‑intensive applications that require large logic density, substantial embedded memory, and high I/O counts.

This device leverages family innovations such as the Intel Hyperflex™ core architecture and 14 nm tri‑gate (FinFET) technology to provide series-level performance and efficiency improvements for demanding designs.

Key Features

• Core and architecture  Intel Stratix® 10 GX family architecture with Hyperflex core elements and Intel 14 nm tri‑gate (FinFET) technology as described in the device family overview.
• Logic capacity  2,800,000 logic elements for implementing large, complex FPGA designs.
• Embedded memory  240,123,904 total RAM bits to support deep buffering, large LUTRAM usage, or on‑chip data storage.
• I/O and connectivity  688 device I/Os to support dense external interfacing and board-level integration.
• Voltage and power  Core voltage supply range 770 mV to 970 mV; device family-level power management features are included in the Stratix® 10 GX overview.
• Package and mounting  1760‑BBGA FCBGA package (supplier package: 1760‑FBGA, 42.5 × 42.5 mm) with surface mount compatibility for high‑density board layouts.
• Operating range and grade  Extended grade with an operating temperature range of 0 °C to 100 °C and RoHS compliance.
• Series-level transceiver and IP support  Stratix® 10 family transceiver and hard IP innovations include high‑speed transceivers, PCI Express hard IP, and programmable DSP blocks as described in the device overview.

Typical Applications

• High‑performance networking and switching  Leverage large logic capacity and high I/O counts to implement packet processing, forwarding engines, and line card functions that require extensive on‑chip resources.
• Data center acceleration  Use the device’s large RAM and logic fabric for compute acceleration, buffering, and custom data‑path implementations in server and accelerator modules.
• High‑speed communications  Support high‑bandwidth PHYs and board‑level interfaces using the family’s transceiver capabilities and extensive I/O for backplane and module connectivity.
• Complex DSP and signal processing  Deploy the substantial logic and memory resources to implement variable‑precision DSP pipelines and large filter/transform engines.

Unique Advantages

• Massive logic density:  2,800,000 logic elements enable integration of large system functions into a single device, reducing external component count.
• Substantial on‑chip RAM:  240,123,904 RAM bits provide headroom for deep buffering, large lookup tables, and high‑bandwidth on‑chip data storage.
• High I/O count:  688 I/Os facilitate rich interfacing options for multi‑lane communications, memory interfaces, and system control signals.
• Production‑ready packaging:  1760‑BBGA FCBGA package (42.5 × 42.5 mm supplier package) supports dense PCB designs while maintaining manufacturability via surface mount mounting.
• Extended operating range:  0 °C to 100 °C operating temperature and Extended grade suitability for thermally demanding board environments.
• RoHS compliant:  Meets RoHS requirements for environmentally conscious manufacturing and assembly.

Why Choose 1SG280HN3F43E3VGS3?

The 1SG280HN3F43E3VGS3 combines very large logic capacity, extensive on‑chip RAM, and a high I/O count in a single Stratix® 10 GX device package, making it well suited for designers who need to consolidate complex system functions into a single FPGA. Its family architecture and advanced process technology provide series-level performance and efficiency advantages applicable to high‑bandwidth networking, data center acceleration, and advanced signal processing.

This device is aimed at teams building high‑density, high‑performance FPGA designs that require scalable logic, deep embedded memory, and robust interfacing while maintaining production readiness through a standard FCBGA package and RoHS compliance.

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