1SG280HN3F43E2VGS3
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,443 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280HN3F43E2VGS3 – Stratix® 10 GX FPGA, 2.8M logic elements, 688 I/Os
The 1SG280HN3F43E2VGS3 is an Intel Stratix® 10 GX field-programmable gate array (FPGA) in a 1760-BBGA FCBGA package. It pairs a high-density programmable fabric—2,800,000 logic elements—with extensive on-chip RAM and 688 I/O pins to address advanced, high-bandwidth processing applications.
Built on the Stratix 10 family architecture, the device leverages family-level innovations such as the Intel Hyperflex core architecture and heterogeneous 3D SiP transceiver technology to deliver increased core performance and integration for demanding communications, data center, and compute-acceleration designs.
Key Features
- Core and architecture Intel Stratix 10 GX family-level innovations including the Intel Hyperflex core architecture are used to deliver increased core performance and efficiency compared to prior generations.
- Programmable fabric 2,800,000 logic elements provide large-scale logic capacity for complex custom hardware implementations.
- On-chip memory 240,123,904 total RAM bits enable extensive buffering, packet processing, and memory-intensive algorithms on-chip.
- I/O and packaging 688 I/Os in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm supplier package) surface-mount package support dense system integration and high pin-count interfacing.
- Power Supported core supply voltage range of 770 mV to 970 mV allows designers to target efficient, low-voltage operation within device requirements.
- Operating range and grade Extended grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance for contemporary assembly requirements.
- Family-level connectivity and IP Stratix 10 GX family features include high-speed transceivers, hard PCIe and Ethernet IP, and advanced DSP/memory blocks (family-level capabilities described in device documentation).
Typical Applications
- High-performance networking Implement packet processing, switch/router data paths, and protocol offload where large logic capacity and abundant I/O are needed.
- Data center acceleration Deploy custom compute acceleration, encryption, or compression engines that require extensive on-chip RAM and DSP resources.
- Telecom and optical systems Support backplane and optical PHY interfacing where high I/O count and family-level high-speed transceiver technology are beneficial.
- Advanced signal processing Realize wideband DSP algorithms and multi-channel processing using the device’s memory and programmable fabric resources.
Unique Advantages
- Massive programmable capacity: 2,800,000 logic elements allow large, complex hardware designs to be implemented on a single device.
- Large on-chip memory: 240,123,904 total RAM bits reduce reliance on external memory for buffering and state storage, simplifying board-level design.
- High-density I/O in a compact package: 688 I/Os in a 1760-BBGA (42.5 × 42.5 mm) footprint enables high system integration while maintaining small PCB area.
- Low-voltage operation: Core supply range of 770 mV to 970 mV supports efficient power design choices.
- Extended-grade thermal range: Rated for 0 °C to 100 °C operation to meet a wide set of application environments.
- Backed by Stratix 10 family documentation: Family-level features such as Hyperflex architecture and advanced transceiver/IP blocks provide a clear upgrade path and design references.
Why Choose 1SG280HN3F43E2VGS3?
The 1SG280HN3F43E2VGS3 positions itself where high programmable capacity, extensive on-chip RAM, and large I/O count are required in a single, surface-mount package. Its specification set supports complex, bandwidth- and memory-intensive designs—making it suitable for networking, data center acceleration, telecom, and advanced signal processing projects that need a scalable FPGA fabric.
Selecting this Stratix 10 GX device provides designers with a high-density, extended-grade FPGA option that aligns with established Stratix 10 family features and documentation, aiding long-term design scalability and integration.
Request a quote or submit an inquiry for pricing and availability to get started with the 1SG280HN3F43E2VGS3 for your next high-performance FPGA design.

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