1SG280HN3F43E2VGS3

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA

Quantity 1,443 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SG280HN3F43E2VGS3 – Stratix® 10 GX FPGA, 2.8M logic elements, 688 I/Os

The 1SG280HN3F43E2VGS3 is an Intel Stratix® 10 GX field-programmable gate array (FPGA) in a 1760-BBGA FCBGA package. It pairs a high-density programmable fabric—2,800,000 logic elements—with extensive on-chip RAM and 688 I/O pins to address advanced, high-bandwidth processing applications.

Built on the Stratix 10 family architecture, the device leverages family-level innovations such as the Intel Hyperflex core architecture and heterogeneous 3D SiP transceiver technology to deliver increased core performance and integration for demanding communications, data center, and compute-acceleration designs.

Key Features

  • Core and architecture  Intel Stratix 10 GX family-level innovations including the Intel Hyperflex core architecture are used to deliver increased core performance and efficiency compared to prior generations.
  • Programmable fabric  2,800,000 logic elements provide large-scale logic capacity for complex custom hardware implementations.
  • On-chip memory  240,123,904 total RAM bits enable extensive buffering, packet processing, and memory-intensive algorithms on-chip.
  • I/O and packaging  688 I/Os in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm supplier package) surface-mount package support dense system integration and high pin-count interfacing.
  • Power  Supported core supply voltage range of 770 mV to 970 mV allows designers to target efficient, low-voltage operation within device requirements.
  • Operating range and grade  Extended grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance for contemporary assembly requirements.
  • Family-level connectivity and IP  Stratix 10 GX family features include high-speed transceivers, hard PCIe and Ethernet IP, and advanced DSP/memory blocks (family-level capabilities described in device documentation).

Typical Applications

  • High-performance networking  Implement packet processing, switch/router data paths, and protocol offload where large logic capacity and abundant I/O are needed.
  • Data center acceleration  Deploy custom compute acceleration, encryption, or compression engines that require extensive on-chip RAM and DSP resources.
  • Telecom and optical systems  Support backplane and optical PHY interfacing where high I/O count and family-level high-speed transceiver technology are beneficial.
  • Advanced signal processing  Realize wideband DSP algorithms and multi-channel processing using the device’s memory and programmable fabric resources.

Unique Advantages

  • Massive programmable capacity: 2,800,000 logic elements allow large, complex hardware designs to be implemented on a single device.
  • Large on-chip memory: 240,123,904 total RAM bits reduce reliance on external memory for buffering and state storage, simplifying board-level design.
  • High-density I/O in a compact package: 688 I/Os in a 1760-BBGA (42.5 × 42.5 mm) footprint enables high system integration while maintaining small PCB area.
  • Low-voltage operation: Core supply range of 770 mV to 970 mV supports efficient power design choices.
  • Extended-grade thermal range: Rated for 0 °C to 100 °C operation to meet a wide set of application environments.
  • Backed by Stratix 10 family documentation: Family-level features such as Hyperflex architecture and advanced transceiver/IP blocks provide a clear upgrade path and design references.

Why Choose 1SG280HN3F43E2VGS3?

The 1SG280HN3F43E2VGS3 positions itself where high programmable capacity, extensive on-chip RAM, and large I/O count are required in a single, surface-mount package. Its specification set supports complex, bandwidth- and memory-intensive designs—making it suitable for networking, data center acceleration, telecom, and advanced signal processing projects that need a scalable FPGA fabric.

Selecting this Stratix 10 GX device provides designers with a high-density, extended-grade FPGA option that aligns with established Stratix 10 family features and documentation, aiding long-term design scalability and integration.

Request a quote or submit an inquiry for pricing and availability to get started with the 1SG280HN3F43E2VGS3 for your next high-performance FPGA design.

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