1SG280HN3F43E2LG

The 1SG280HN3F43E2LG is an Intel Stratix® 10 GX family FPGA packaged in a 1760-ball FCBGA (42.5 × 42.5 mm). It provides a large programmable fabric and high-density I/O for advanced, high-bandwidth applications.

Built on the Stratix 10 architecture, the device leverages the family’s Hyperflex core innovations and high-speed transceiver capabilities to address demanding designs that require extensive logic resources, large on-chip memory, and high-speed serial connectivity.

Key Features

• Programmable Fabric — Approximately 2,800,000 logic elements for large-scale logic integration and complex system implementation.
• Embedded Memory — 240,123,904 total RAM bits to support large buffering, on-chip datasets, and memory-intensive algorithms.
• High-Density I/O — 688 user I/Os to accommodate wide parallel interfaces and multiple high-speed channels.
• Advanced Package — 1760-BBGA (1760-FBGA supplier package, 42.5 × 42.5 mm) surface-mount package for dense board-level integration.
• Low-Voltage Core Supply — Core voltage range 820 mV to 880 mV to match platform power delivery requirements.
• Operating Range & Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Compliance — RoHS compliant.
• Family-Level Innovations — Stratix 10 family features such as the Intel Hyperflex core architecture, 14 nm tri-gate (FinFET) technology, heterogeneous 3D SiP transceiver tiles, high-speed transceivers, hard PCI Express Gen3 x16 IP, M20K internal SRAM blocks, and variable-precision DSP blocks (as described in the Stratix 10 family documentation).

Typical Applications

• High-Speed Networking & Telecom — Implements multi-channel serial links and protocol offload using the family’s high-speed transceiver capabilities and large logic fabric.
• Data Center Acceleration — Supports compute offload, packet processing, and custom acceleration pipelines that require significant logic and on-chip memory.
• Backplane and Interface Bridging — Enables high-bandwidth chip-to-chip and module connectivity with dense I/O and transceiver support.
• Signal Processing & DSP — Hosts variable-precision DSP blocks and large RAM to perform real-time, high-throughput signal processing tasks.

Unique Advantages

• Massive programmable capacity: About 2.8 million logic elements enable integration of complex, multi-function designs on a single device.
• Substantial on-chip memory: 240,123,904 RAM bits reduce external memory dependence for latency-sensitive buffering and caching.
• High I/O density: 688 I/Os provide flexibility for broad parallel interfaces, multiple SERDES lanes, and mixed-signal front-ends.
• High-speed connectivity options: Family transceiver and hard-IP features allow implementation of industry-standard high-speed links and protocol IP.
• Optimized for compact systems: The 1760-FBGA package (42.5 × 42.5 mm) supports dense PCB layouts while the device’s surface-mount form factor eases assembly.
• Designed for modern power domains: Core supply range (820 mV–880 mV) accommodates contemporary low-voltage FPGA power architectures.

Why Choose 1SG280HN3F43E2LG?

This Stratix 10 GX device combines a very large programmable fabric, extensive on-chip memory, and high I/O density in a compact FCBGA package, making it suited for advanced designs that demand throughput, integration, and flexible interfacing. The device benefits from Stratix 10 family innovations—such as the Hyperflex core architecture and heterogeneous transceiver technology—that are targeted at high-performance, bandwidth-intensive applications.

Design teams focused on networking, data-center acceleration, high-speed bridging, or intensive signal-processing tasks will find the 1SG280HN3F43E2LG appropriate where significant logic resources, large embedded memory, and extensive I/O are required. The combination of package, operating range, and supply parameters supports robust platform integration and long-term deployment in extended-grade environments.

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