1SG280HN2F43I2VG

The 1SG280HN2F43I2VG is an Intel Stratix® 10 GX family FPGA offered in a 1760-BBGA FCBGA package for surface-mount applications. It leverages the Stratix 10 family architecture to target high-bandwidth, high-performance industrial applications requiring large programmable logic capacity and substantial on-chip memory.

Designed for demanding processing and I/O tasks, this device combines a high logic element count, large embedded RAM, wide I/O support and a low-voltage core supply range to deliver performance and efficiency for advanced FPGA designs.

Key Features

• Core Architecture  Family-level features include the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology as described in the Stratix 10 GX device overview.
• Logic Capacity  2,800,000 logic elements (cells) for large, complex designs.
• On-Chip Memory  240,123,904 total RAM bits to support buffering, large state machines and data processing tasks.
• I/O and Connectivity  688 user I/O pins to support broad peripheral and interface integration.
• Power Supply  Core voltage supply range from 770 mV to 970 mV for the device core.
• Package and Mounting  1760-BBGA (FCBGA) package, supplier device package 1760-FBGA (42.5 × 42.5 mm); surface-mount mounting type.
• Operating Range  Industrial-grade operation from −40 °C to 100 °C.
• Standards and Compliance  RoHS compliant for environmental material requirements.

Typical Applications

• High-performance networking and switching  Large logic and extensive RAM enable packet processing, traffic management and custom forwarding engines.
• Telecommunications and optical transport  High I/O count and family transceiver capability (as described in the Stratix 10 GX overview) support high-bandwidth links and protocol processing.
• Data center acceleration  Substantial logic and memory resources are suited for offload engines, custom accelerators and inline processing.
• Signal processing and test equipment  Large RAM and logic capacity support complex DSP pipelines and high-throughput measurement tasks.
• Industrial control and automation  Industrial temperature grade and robust I/O counts support machine control, motion control and complex system integration.

Unique Advantages

• Massive programmable logic: 2.8 million logic elements provide the headroom for very large designs and system integration on a single device.
• Large on-chip RAM: 240,123,904 bits of embedded memory reduce external memory dependence and improve processing latency for data-heavy designs.
• High I/O density: 688 I/Os enable direct interfacing to multiple peripherals, high-speed lanes and complex mezzanine interconnects.
• Industrial operating range: −40 °C to 100 °C supports deployment in industrial environments with extended temperature requirements.
• Compact high-pin package: 1760-BBGA (42.5 × 42.5 mm) provides a high-density footprint for complex system designs while maintaining surface-mount manufacturability.
• Environmentally compliant: RoHS compliance supports regulatory and corporate material requirements.

Why Choose 1SG280HN2F43I2VG?

The 1SG280HN2F43I2VG positions designers to consolidate complex system functions into a single, high-capacity Stratix 10 GX FPGA. With 2.8 million logic elements, over 240 million bits of on-chip RAM, and nearly 700 I/Os in a high-density FCBGA package, this device is suited to advanced industrial applications that require substantial programmable resources, generous memory, and robust I/O integration.

Engineers building high-bandwidth, compute-intensive solutions will find the device’s family-level architectural features and industrial temperature range beneficial for scalable, long-term deployments where integration density and deterministic on-board processing matter.

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