1SG280HN2F43I1VG

The 1SG280HN2F43I1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) device optimized for high-bandwidth, high-compute applications. It combines the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) process innovations to deliver significantly higher core performance and reduced power compared to previous-generation high-performance FPGAs.

With 2,800,000 logic elements, extensive on-chip RAM and high-speed I/O, this industrial-grade, surface-mount FPGA targets networking, compute acceleration, telecom and industrial communication systems that require large logic capacity, massive memory bandwidth and robust thermal range.

Key Features

• Core Architecture  Intel Hyperflex™ core architecture and 14 nm tri-gate (FinFET) technology provide the foundation for increased core performance and power efficiency as described in the device family overview.
• Logic Capacity  2,800,000 logic elements for large-scale custom logic, complex state machines and deep pipeline implementations.
• Embedded Memory  240,123,904 total RAM bits of on-chip memory to support buffering, packet processing and data staging; the device family also uses M20K internal SRAM memory blocks.
• High-Speed I/O and Transceivers  688 I/O pins and transceiver support (device family transceivers support up to 28.3 Gbps chip-to-chip/module and backplane performance) for demanding serial connectivity and high-throughput interfaces.
• Interfaces & Hard IP  Device family-level features include hard PCI Express Gen1/Gen2/Gen3 IP, 10G Ethernet hard IP, and memory controller/PHY support for DDR4 rates (as described in the Stratix 10 GX family overview).
• Power and Voltage  Core voltage supply range of 770 mV to 970 mV, enabling low-voltage operation in power-sensitive systems.
• Package & Mounting  1760-ball BGA, FCBGA package (1760-FBGA, 42.5 × 42.5 mm) in a surface-mount format for high-density board designs.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet deployment requirements in industrial environments.
• System Reliability & Security  Family-level features include device configuration management and mechanisms for error detection and correction to support reliable operation in critical systems.

Typical Applications

• High‑Performance Networking  Line cards, switch fabric and router engines that require large logic density, extensive on-chip memory and high-speed transceivers for multi‑10G and higher backplane connectivity.
• Data Center Acceleration  Custom compute and acceleration modules that leverage abundant logic elements and embedded RAM to implement packet processing, lookup tables and streaming data pipelines.
• Telecom & Optical Modules  Transceiver-heavy telecom designs and optical modules that benefit from the device family’s high-speed serial capabilities and built-in protocol IP options.
• Industrial Communication & Control  Industrial automation and communications systems that require an industrial temperature range, large I/O counts and high on-chip memory for real-time processing and protocol handling.

Unique Advantages

• Massive Logic Scale:  2.8M logic elements enable consolidation of multiple functions onto a single device, reducing board-level complexity and component count.
• Large On‑Chip Memory:  Over 240 million bits of RAM support deep buffering and stateful processing, minimizing external memory dependence for many streaming and packet-based architectures.
• High‑Speed Connectivity:  688 I/O and family-level transceiver capabilities up to 28.3 Gbps provide the bandwidth required for modern backplane, module and chip‑to‑chip interconnects.
• Industrial‑Grade Thermal Range:  −40 °C to 100 °C operating range supports deployment in harsh and factory-floor environments without additional thermal derating.
• Low‑Voltage Core Operation:  770 mV–970 mV core supply range supports power-optimized system design choices.
• Integrated System IP:  Family-level hard IP options for PCIe, Ethernet and memory controllers accelerate system integration and reduce development time for common interfaces.

Why Choose 1SG280HN2F43I1VG?

The 1SG280HN2F43I1VG positions itself for applications that demand substantial programmable logic, abundant on-chip memory and robust high‑speed I/O in an industrial-grade package. Its combination of Hyperflex architecture, large logic and memory resources, and family-level high‑speed interface IP makes it suitable for designers consolidating functions, accelerating data paths, or implementing complex protocol stacks.

For teams building networking, telecom, data center acceleration or industrial communication systems, this Stratix 10 GX device delivers the scalability, thermal range and interface capability needed to shorten design cycles and simplify system-level architecture while leveraging the documented device family innovations in performance and power efficiency.

Request a quote or submit an inquiry for pricing, availability and technical support to evaluate the 1SG280HN2F43I1VG for your next design.