1SG280HN2F43I1VGAS

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA

Quantity 1,987 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SG280HN2F43I1VGAS – Stratix® 10 GX FPGA, 688 I/O, 2,800,000 logic elements

The 1SG280HN2F43I1VGAS is an Intel Stratix® 10 GX field programmable gate array in a 1760-ball FCBGA package optimized for high-density, high-performance system designs. Built on the Stratix 10 GX family architecture, this device combines a large programmable fabric with extensive on-chip memory and high I/O density for demanding networking, compute and signal-processing applications.

With 2,800,000 logic elements, 240,123,904 bits of on-chip RAM and 688 I/O pins, this industrial-grade surface-mount device is designed for systems requiring high throughput, significant local memory and a compact 42.5 × 42.5 mm package footprint. The device supports core supply operation from 770 mV to 970 mV and operates across an industrial temperature range of −40 °C to 100 °C.

Key Features

  • Programmable Fabric  2,800,000 logic elements provide large-scale programmable capacity for complex logic, control and data-path implementations.
  • On-Chip Memory  240,123,904 total RAM bits enable extensive buffer, lookup table and embedded-memory usage without external memory dependency for many functions.
  • High I/O Count  688 I/O pins support dense system interconnects and multiple high-speed interfaces on a single device.
  • Industrial Grade Temperature  Specified to operate from −40 °C to 100 °C for reliable operation in industrial environments.
  • Power and Supply  Core supply range of 770 mV to 970 mV to match platform power-rail designs and enable targeted power management strategies.
  • Package & Mounting  1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package provides a compact, high-density solution for board-level integration.
  • Compliance  RoHS compliant for regulatory and manufacturing compatibility in commercial and industrial product lines.
  • Family-Level Innovations (from Stratix 10 GX series)  Includes Intel Hyperflex core architecture, 14 nm tri-gate process, heterogeneous 3D SiP transceiver tiles, high-performance transceivers and hard IP blocks as detailed in the Stratix 10 GX device family overview.

Typical Applications

  • High-performance networking  Use the device’s large logic capacity, abundant I/O and family-level high-speed transceivers to implement packet processing, switching and line-rate protocol offload functions.
  • Data center acceleration  On-chip memory and dense logic elements enable custom acceleration engines and data-paths for compute and storage systems.
  • Advanced signal processing  Large RAM capacity and extensive logic resources support real-time DSP implementations, filtering and complex algorithm pipelines.
  • Telecommunications infrastructure  High I/O count and family-level transceiver capabilities support backplane and module interfaces used in telecom equipment.

Unique Advantages

  • Massive programmable capacity: 2.8 million logic elements let designers implement complex SoC-class functions within a single FPGA.
  • Substantial on-chip RAM: 240,123,904 bits of internal RAM reduce dependence on external memory for many buffering and data-storage tasks, simplifying BOM and board layout.
  • High I/O integration: 688 I/O pins allow multiple high-speed interfaces and parallel connections without additional bridge components.
  • Industrial temperature support: −40 °C to 100 °C rating provides robustness for factory-floor and other industrial deployments.
  • Compact, high-density package: 1760-BBGA (42.5 × 42.5 mm) keeps system size small while delivering large logic and memory capacity.
  • Family-proven architecture: Leverages Stratix 10 GX series innovations—such as the Hyperflex core and 14 nm FinFET process—documented in the device overview for performance and power efficiency planning.

Why Choose 1SG280HN2F43I1VGAS?

This Stratix 10 GX device positions itself for designs that demand large-scale programmable logic, abundant on-chip memory and extensive I/O in a single industrial-grade FPGA. It is suitable for system architects and design teams building high-throughput networking, compute acceleration or advanced signal-processing solutions who require a compact package and robust temperature performance.

Choosing this device gives access to the Stratix 10 GX family architecture benefits indicated in the device overview, combined with specific device-level resources (logic, RAM, I/O, package and supply requirements) for scalable, long-life production deployments.

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