1SG280HN2F43E2VG

The 1SG280HN2F43E2VG is a Stratix® 10 GX field programmable gate array (FPGA) in a 1760‑BBGA (1760‑FBGA, 42.5 × 42.5 mm) package. It delivers very high logic capacity, large on‑chip memory, and extensive I/O for advanced, bandwidth‑ and compute‑intensive designs.

As a member of the Intel Stratix 10 GX family, the device leverages family innovations such as the Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate technology to address demanding applications in communications, data center acceleration, and high‑performance systems.

Key Features

• High Logic Density — Approximately 2,800,000 logic elements to implement large, complex programmable designs.
• On‑Chip Memory — Total RAM of 240,123,904 bits for buffer, packet, and data‑processing needs.
• I/O and Packaging — 688 user I/O pins in a 1760‑BBGA FCBGA package (1760‑FBGA, 42.5 × 42.5 mm) for dense board integration and high connector count.
• Core Power Supply — Core voltage supply range of 770 mV to 970 mV to match precise core power requirements.
• Extended Temperature Grade — Rated for operation from 0 °C to 100 °C, with Extended grade classification.
• Family-Level Architecture — Part of the Stratix 10 GX family that incorporates Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology, delivering improved core performance and power characteristics.
• High‑Speed Transceiver Technology (Family) — Stratix 10 family documentation cites transceiver data rates up to 28.3 Gbps and support for multi‑channel high‑speed links (family feature).
• Compliance — RoHS compliant.

Typical Applications

• High‑Performance Networking — Implements packet processing, switch/fabric interface logic, and protocol acceleration where large logic capacity and many I/Os are required.
• Data Center Acceleration — Handles compute‑intensive offload engines and custom accelerators that need abundant logic and on‑chip RAM.
• Telecommunications & Optical Transport — Supports high‑bandwidth transceiver interfaces and large buffering for backplane and module designs (leveraging Stratix 10 family transceiver capabilities).
• Test & Measurement — Provides the logic density and I/O count for high‑channel count acquisition, processing, and custom instrumentation logic.

Unique Advantages

• Large Programmable Fabric: 2.8 million logic elements enable highly complex, deeply pipelined designs and multi‑function integration on a single device.
• Substantial On‑Chip Memory: 240,123,904 bits of RAM reduce external memory dependence for buffering and dataflow, simplifying board design.
• High I/O Count in a Dense Package: 688 I/Os in a 1760‑BBGA footprint support dense connectivity to high‑speed serializers, memory, and peripherals.
• Precision Core Power Range: 770 mV–970 mV core supply range aligns with tight power delivery and efficiency requirements of advanced FPGA fabrics.
• Family Architecture Benefits: As part of the Stratix 10 GX family, the device benefits from Hyperflex core architecture and 14 nm tri‑gate technology for improved performance and efficiency at the device‑level.
• Extended Thermal Operating Range: 0 °C to 100 °C rating accommodates a wide set of commercial and extended‑environment applications.

Why Choose 1SG280HN2F43E2VG?

The 1SG280HN2F43E2VG positions itself for complex, high‑bandwidth designs that require a large programmable fabric, extensive on‑chip memory, and substantial I/O in a compact BGA package. Its Stratix 10 GX family heritage brings architectural advances such as the Hyperflex core and a 14 nm FinFET process that support higher core performance and improved power efficiency.

This device is suited to systems architects and engineers building next‑generation networking, data center acceleration, telecommunications, and measurement equipment who need scalable logic capacity, robust memory resources, and a dense I/O footprint in a production‑grade, RoHS‑compliant FPGA.

Request a quote or submit an inquiry today to evaluate 1SG280HN2F43E2VG for your next high‑performance FPGA design.