1SG280HN2F43E2LGAS

The 1SG280HN2F43E2LGAS is an Intel Stratix® 10 GX field programmable gate array in a 1760-BBGA (FCBGA) package. It delivers a high‑capacity programmable fabric with 2,800,000 logic elements and large embedded RAM complemented by a wide I/O count for complex, high‑bandwidth designs.

Designed for advanced computing and communications applications, this Stratix 10 GX device offers series innovations such as the Intel Hyperflex core architecture and FinFET process technology to address demanding throughput and processing requirements while optimizing power and integration.

Key Features

• Logic Capacity — 2,800,000 logic elements for implementing large, complex designs and extensive custom hardware acceleration.
• On‑Chip Memory — 240,123,904 total RAM bits to support large buffering, packet processing, and in‑fabric data storage.
• I/O Density — 688 I/O pins to support broad interface connectivity and multi‑lane high‑speed link architectures.
• Power and Voltage — Core voltage supply range 820 mV to 880 mV for the programmable core domain.
• Package — 1760‑BBGA FCBGA (supplier package 1760‑FBGA, 42.5 × 42.5 mm) surface‑mount package for high‑pin‑count system integration.
• Operating Range — Extended grade with an operating temperature range of 0 °C to 100 °C for demanding thermal environments.
• Standards and Compliance — RoHS compliant.
• Series Architecture Highlights — Intel Stratix 10 series innovations (series-level information) include the Intel Hyperflex core architecture, Intel 14 nm tri‑gate (FinFET) technology, heterogeneous 3D SiP transceiver tiles, and advanced hard IP such as PCI Express and 10G Ethernet.
• High‑Speed Transceivers (Series‑Level) — Series supports transceiver data rates up to 28.3 Gbps and hard IP for PCI Express Gen1/Gen2/Gen3 and 10G/40G Ethernet (series features).

Typical Applications

• High‑Performance Networking — Implement packet processing, switching and backplane interfaces using the device’s high logic capacity, abundant RAM, and dense I/O.
• Data Acceleration and Compute — Hardware acceleration and custom datapath implementations that require large logic and memory resources.
• Telecom and Optical Transport — Support for high‑speed transceiver links and multi‑lane interfaces in transport and line‑card designs (leveraging series‑level transceiver and Ethernet IP).

Unique Advantages

• High integration density: 2,800,000 logic elements and 240,123,904 bits of on‑chip RAM reduce external memory and FPGA partitioning needs for complex systems.
• Extensive I/O: 688 I/O pins enable broad connectivity and flexible interface mapping for multi‑lane and multi‑protocol designs.
• Package optimized for system assembly: 1760‑BBGA FCBGA (42.5 × 42.5 mm) balances pin count and board‑level integration for high‑density systems.
• Power domain control: Narrow core voltage range (820 mV–880 mV) supports predictable power budgeting and integration with modern power supplies.
• Extended operating range: 0 °C to 100 °C rating suits a wide range of equipment environments where extended thermal headroom is required.
• Series innovations available: Benefits from Stratix 10 series architectural advances such as the Hyperflex core, 14 nm FinFET process, and high‑speed transceiver technology (series‑level features).

Why Choose 1SG280HN2F43E2LGAS?

This Stratix 10 GX FPGA is positioned for designs that demand large programmable capacity, substantial embedded memory, and high I/O density in a single device. Its combination of logic scale, on‑chip RAM, and package pin‑count makes it suitable for complex networking, compute acceleration, and telecom infrastructure implementations.

Choosing this device provides long‑term design scalability by leveraging the Stratix 10 series architecture and ecosystem. The extended grade and RoHS compliance support reliable operation and regulatory alignment across deployment environments.

Request a quote or submit a sales inquiry to get pricing, availability, and support for integrating the 1SG280HN2F43E2LGAS into your design.