1SG280HN1F43I2VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,555 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280HN1F43I2VG – Stratix® 10 GX FPGA, 2,800,000 logic elements, 1760-FBGA
The 1SG280HN1F43I2VG is a Stratix® 10 GX field programmable gate array (FPGA) in a 1760-FBGA (42.5 × 42.5 mm) package. Built on the Stratix 10 family architecture, it delivers large logic capacity, extensive on-chip RAM, and high I/O density for demanding compute, networking, and signal-processing designs.
With 2,800,000 logic elements, 240,123,904 total RAM bits, and 688 I/O pins, this industrial-grade device is targeted at applications that require high integration, high throughput serial connectivity, and robust thermal and voltage operating margins.
Key Features
- Core Architecture Based on the Stratix 10 GX family architecture as described in the device overview, including Intel Hyperflex core innovations referenced for the series.
- Logic Capacity 2,800,000 logic elements provide substantial programmable fabric for complex logic and custom acceleration functions.
- On‑Die Memory 240,123,904 total RAM bits available for packet buffering, lookup tables, and high-speed data structures.
- High‑Density I/O 688 I/O pins support broad connectivity to external devices, memory interfaces, and high-speed transceivers.
- High‑Speed Transceiver and IP Capabilities (Series) Stratix 10 GX family documentation describes high-performance transceivers and hard IP including PCI Express Gen3, 10G Ethernet FEC, and support for high-rate serial links.
- Power and Voltage Operates across a core voltage supply range of 770 mV to 970 mV, enabling designs that target the specified power domains.
- Package & Mounting 1760-FBGA (42.5 × 42.5 mm) surface-mount package suitable for dense board-level integration.
- Industrial Temperature Grade Rated for operation from −40°C to 100°C for deployment in industrial temperature environments.
- Series-Level Innovations Stratix 10 family features cited in the device overview include 14 nm FinFET technology, 3D SiP transceiver tiles, M20K internal SRAM blocks, and variable-precision DSP capabilities—relevant to designs built on Stratix 10 GX devices.
Typical Applications
- High‑Performance Networking Use for switch, router, and packet-processing engines that need large on-chip RAM, dense logic, and extensive I/O for high-throughput frame handling.
- Data Center Acceleration Suitable for hardware acceleration tasks that require substantial logic resources and fast interfaces to host systems and memory.
- High‑Speed Serial and Backplane Systems Well-suited for designs leveraging high-rate transceivers and hard protocol IP (as described for the series) for backplane and module interconnects.
- Signal Processing and DSP Applicable to compute-intensive DSP workloads where large RAM and abundant logic allow implementation of complex pipelines and buffering.
- Embedded SoC Platforms For designs that integrate programmable fabric with hard IP and high I/O counts to implement system-level processing and control functions.
Unique Advantages
- Massive Logic Density: 2.8M logic elements provide room for large custom accelerators and complex system logic without partitioning across multiple devices.
- Large On‑Chip Memory: 240M+ bits of RAM reduce dependence on external buffering, improving throughput and latency for packet and data-intensive tasks.
- Extensive I/O Count: 688 I/Os enable high connectivity to multiple peripherals, memory channels, and board-level interfaces in a single FPGA.
- Industrial Temperature Range: Rated −40°C to 100°C for deployments in environments with wide thermal variation.
- Compact, High‑Density Package: 1760-FBGA packaging provides a small footprint relative to the device capability for dense PCB integration.
- Series-Level High-Speed Ecosystem: Stratix 10 GX family features such as high-rate transceivers, PCIe and Ethernet hard IP, and DSP resources support high-bandwidth system designs.
Why Choose 1SG280HN1F43I2VG?
The 1SG280HN1F43I2VG combines very high logic capacity, substantial on‑chip RAM, and extensive I/O in an industrial-grade Stratix 10 GX FPGA package. It is positioned for engineers designing high-throughput networking, acceleration, and signal-processing systems that require integrated resources and industrial operating margins.
Choose this device when your design demands large programmable fabric, significant embedded memory, broad I/O connectivity, and the series-level high-speed IP and transceiver capabilities described in the Stratix 10 GX documentation. Its package and voltage range make it suitable for compact, high-performance board-level integration with predictable thermal and power considerations.
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