1SG280HN1F43I2VG

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA

Quantity 1,555 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SG280HN1F43I2VG – Stratix® 10 GX FPGA, 2,800,000 logic elements, 1760-FBGA

The 1SG280HN1F43I2VG is a Stratix® 10 GX field programmable gate array (FPGA) in a 1760-FBGA (42.5 × 42.5 mm) package. Built on the Stratix 10 family architecture, it delivers large logic capacity, extensive on-chip RAM, and high I/O density for demanding compute, networking, and signal-processing designs.

With 2,800,000 logic elements, 240,123,904 total RAM bits, and 688 I/O pins, this industrial-grade device is targeted at applications that require high integration, high throughput serial connectivity, and robust thermal and voltage operating margins.

Key Features

  • Core Architecture  Based on the Stratix 10 GX family architecture as described in the device overview, including Intel Hyperflex core innovations referenced for the series.
  • Logic Capacity  2,800,000 logic elements provide substantial programmable fabric for complex logic and custom acceleration functions.
  • On‑Die Memory  240,123,904 total RAM bits available for packet buffering, lookup tables, and high-speed data structures.
  • High‑Density I/O  688 I/O pins support broad connectivity to external devices, memory interfaces, and high-speed transceivers.
  • High‑Speed Transceiver and IP Capabilities (Series)  Stratix 10 GX family documentation describes high-performance transceivers and hard IP including PCI Express Gen3, 10G Ethernet FEC, and support for high-rate serial links.
  • Power and Voltage  Operates across a core voltage supply range of 770 mV to 970 mV, enabling designs that target the specified power domains.
  • Package & Mounting  1760-FBGA (42.5 × 42.5 mm) surface-mount package suitable for dense board-level integration.
  • Industrial Temperature Grade  Rated for operation from −40°C to 100°C for deployment in industrial temperature environments.
  • Series-Level Innovations  Stratix 10 family features cited in the device overview include 14 nm FinFET technology, 3D SiP transceiver tiles, M20K internal SRAM blocks, and variable-precision DSP capabilities—relevant to designs built on Stratix 10 GX devices.

Typical Applications

  • High‑Performance Networking  Use for switch, router, and packet-processing engines that need large on-chip RAM, dense logic, and extensive I/O for high-throughput frame handling.
  • Data Center Acceleration  Suitable for hardware acceleration tasks that require substantial logic resources and fast interfaces to host systems and memory.
  • High‑Speed Serial and Backplane Systems  Well-suited for designs leveraging high-rate transceivers and hard protocol IP (as described for the series) for backplane and module interconnects.
  • Signal Processing and DSP  Applicable to compute-intensive DSP workloads where large RAM and abundant logic allow implementation of complex pipelines and buffering.
  • Embedded SoC Platforms  For designs that integrate programmable fabric with hard IP and high I/O counts to implement system-level processing and control functions.

Unique Advantages

  • Massive Logic Density:  2.8M logic elements provide room for large custom accelerators and complex system logic without partitioning across multiple devices.
  • Large On‑Chip Memory:  240M+ bits of RAM reduce dependence on external buffering, improving throughput and latency for packet and data-intensive tasks.
  • Extensive I/O Count:  688 I/Os enable high connectivity to multiple peripherals, memory channels, and board-level interfaces in a single FPGA.
  • Industrial Temperature Range:  Rated −40°C to 100°C for deployments in environments with wide thermal variation.
  • Compact, High‑Density Package:  1760-FBGA packaging provides a small footprint relative to the device capability for dense PCB integration.
  • Series-Level High-Speed Ecosystem:  Stratix 10 GX family features such as high-rate transceivers, PCIe and Ethernet hard IP, and DSP resources support high-bandwidth system designs.

Why Choose 1SG280HN1F43I2VG?

The 1SG280HN1F43I2VG combines very high logic capacity, substantial on‑chip RAM, and extensive I/O in an industrial-grade Stratix 10 GX FPGA package. It is positioned for engineers designing high-throughput networking, acceleration, and signal-processing systems that require integrated resources and industrial operating margins.

Choose this device when your design demands large programmable fabric, significant embedded memory, broad I/O connectivity, and the series-level high-speed IP and transceiver capabilities described in the Stratix 10 GX documentation. Its package and voltage range make it suitable for compact, high-performance board-level integration with predictable thermal and power considerations.

Request a quote or contact sales to discuss availability, lead time, and pricing for 1SG280HN1F43I2VG.

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