1SG280HN2F43E1VG

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA

Quantity 606 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SG280HN2F43E1VG – Stratix® 10 GX FPGA, 1760‑BBGA, 688 I/O

The Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) 1SG280HN2F43E1VG is a high‑capacity FPGA in a 1760‑ball BGA package designed for advanced, bandwidth‑intensive systems. Built on the Stratix 10 GX family architecture, the device targets high‑performance compute and communications applications that require large logic capacity, extensive on‑chip memory, and dense I/O.

This device combines the Stratix 10 GX family technology with a large logic fabric (2,800,000 logic elements), substantial embedded RAM (240,123,904 bits), and 688 I/O pins, delivering an integration point for systems where performance, memory, and I/O density are critical.

Key Features

  • High Logic Capacity  Provides 2,800,000 logic elements to implement complex FPGA designs and large custom accelerators.
  • Logic Array Detail  Contains 350,000 CLB‑equivalent units reported in device metadata to support substantial parallel logic structures.
  • Large On‑Chip Memory  Total embedded RAM of 240,123,904 bits for buffering, packet processing, and intermediate storage without external memory dependence.
  • Extensive I/O  688 user I/O pins enable dense external interfacing for multi‑lane high‑speed links and parallel peripherals.
  • Stratix 10 Family Innovations  Leverages the Stratix 10 GX family architecture, including the Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology as described in the device family overview.
  • Advanced Transceiver and IP Capabilities  Family level features include heterogeneous 3D SiP transceiver tiles, high‑rate transceivers, hard PCIe IP, and hard Ethernet/FEC options as documented for Stratix 10 GX devices.
  • Power and Supply  Core voltage supply range specified at 770 mV to 970 mV for the device core supply requirements.
  • Package and Mounting  Surface mount 1760‑BBGA / 1760‑FBGA package (42.5 mm × 42.5 mm) suitable for dense board integration.
  • Operating Range and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • High‑Performance Networking: Implement packet processing, forwarding engines, and line cards that require large logic capacity and dense I/O for multi‑lane interfaces.
  • Data Center Acceleration: Deploy hardware accelerators and protocol offloads that benefit from extensive on‑chip RAM and large logic resources.
  • Telecom Infrastructure: Use in backplane and module designs that need high I/O counts and Stratix 10 family transceiver/IP capabilities for high‑bandwidth links.
  • Test & Measurement: Integrate complex signal processing and data capture pipelines that require memory depth and programmable logic flexibility.

Unique Advantages

  • Large Programmable Fabric: 2.8 million logic elements enable implementation of highly parallel, compute‑intensive designs without partitioning across multiple FPGAs.
  • Substantial On‑Chip Memory: 240,123,904 bits of embedded RAM reduce dependence on external memory and simplify memory architecture for buffering and packet staging.
  • High I/O Density: 688 I/O pins support complex multi‑lane interfaces and dense peripheral connectivity on a single package.
  • Family‑Level High‑Speed Interfaces: Stratix 10 GX family features (transceivers, PCIe, Ethernet/FEC, DDR4 support) provide design building blocks for high‑bandwidth systems as documented in the device family overview.
  • Compact, High‑Pin Package: 1760‑ball FBGA (42.5 × 42.5 mm) delivers high integration density for space‑constrained PCBs while supporting extensive I/O and power delivery.
  • Regulatory and Environmental Compliance: RoHS compliance supports environmentally conscious design and procurement requirements.

Why Choose 1SG280HN2F43E1VG?

The 1SG280HN2F43E1VG Stratix 10 GX FPGA provides a high‑capacity, high‑I/O programmable platform aligned to demanding applications in networking, data center acceleration, and telecom infrastructure. Its combination of 2,800,000 logic elements, large embedded RAM, and 688 I/O pins makes it well suited for designs that require extensive on‑chip resources and dense external interfacing.

As a Stratix 10 GX family device, it benefits from the family’s architectural innovations and IP building blocks described in the device overview, offering a clear migration path for systems that need scalable performance and integration over time.

Request a quote to begin procurement or to obtain technical and pricing information for 1SG280HN2F43E1VG. Our team will provide availability and support details to help you specify this device into your design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up