1SG280HN2F43E1VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 606 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280HN2F43E1VG – Stratix® 10 GX FPGA, 1760‑BBGA, 688 I/O
The Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) 1SG280HN2F43E1VG is a high‑capacity FPGA in a 1760‑ball BGA package designed for advanced, bandwidth‑intensive systems. Built on the Stratix 10 GX family architecture, the device targets high‑performance compute and communications applications that require large logic capacity, extensive on‑chip memory, and dense I/O.
This device combines the Stratix 10 GX family technology with a large logic fabric (2,800,000 logic elements), substantial embedded RAM (240,123,904 bits), and 688 I/O pins, delivering an integration point for systems where performance, memory, and I/O density are critical.
Key Features
- High Logic Capacity Provides 2,800,000 logic elements to implement complex FPGA designs and large custom accelerators.
- Logic Array Detail Contains 350,000 CLB‑equivalent units reported in device metadata to support substantial parallel logic structures.
- Large On‑Chip Memory Total embedded RAM of 240,123,904 bits for buffering, packet processing, and intermediate storage without external memory dependence.
- Extensive I/O 688 user I/O pins enable dense external interfacing for multi‑lane high‑speed links and parallel peripherals.
- Stratix 10 Family Innovations Leverages the Stratix 10 GX family architecture, including the Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology as described in the device family overview.
- Advanced Transceiver and IP Capabilities Family level features include heterogeneous 3D SiP transceiver tiles, high‑rate transceivers, hard PCIe IP, and hard Ethernet/FEC options as documented for Stratix 10 GX devices.
- Power and Supply Core voltage supply range specified at 770 mV to 970 mV for the device core supply requirements.
- Package and Mounting Surface mount 1760‑BBGA / 1760‑FBGA package (42.5 mm × 42.5 mm) suitable for dense board integration.
- Operating Range and Grade Extended grade device with an operating temperature range of 0 °C to 100 °C.
- Compliance RoHS compliant.
Typical Applications
- High‑Performance Networking: Implement packet processing, forwarding engines, and line cards that require large logic capacity and dense I/O for multi‑lane interfaces.
- Data Center Acceleration: Deploy hardware accelerators and protocol offloads that benefit from extensive on‑chip RAM and large logic resources.
- Telecom Infrastructure: Use in backplane and module designs that need high I/O counts and Stratix 10 family transceiver/IP capabilities for high‑bandwidth links.
- Test & Measurement: Integrate complex signal processing and data capture pipelines that require memory depth and programmable logic flexibility.
Unique Advantages
- Large Programmable Fabric: 2.8 million logic elements enable implementation of highly parallel, compute‑intensive designs without partitioning across multiple FPGAs.
- Substantial On‑Chip Memory: 240,123,904 bits of embedded RAM reduce dependence on external memory and simplify memory architecture for buffering and packet staging.
- High I/O Density: 688 I/O pins support complex multi‑lane interfaces and dense peripheral connectivity on a single package.
- Family‑Level High‑Speed Interfaces: Stratix 10 GX family features (transceivers, PCIe, Ethernet/FEC, DDR4 support) provide design building blocks for high‑bandwidth systems as documented in the device family overview.
- Compact, High‑Pin Package: 1760‑ball FBGA (42.5 × 42.5 mm) delivers high integration density for space‑constrained PCBs while supporting extensive I/O and power delivery.
- Regulatory and Environmental Compliance: RoHS compliance supports environmentally conscious design and procurement requirements.
Why Choose 1SG280HN2F43E1VG?
The 1SG280HN2F43E1VG Stratix 10 GX FPGA provides a high‑capacity, high‑I/O programmable platform aligned to demanding applications in networking, data center acceleration, and telecom infrastructure. Its combination of 2,800,000 logic elements, large embedded RAM, and 688 I/O pins makes it well suited for designs that require extensive on‑chip resources and dense external interfacing.
As a Stratix 10 GX family device, it benefits from the family’s architectural innovations and IP building blocks described in the device overview, offering a clear migration path for systems that need scalable performance and integration over time.
Request a quote to begin procurement or to obtain technical and pricing information for 1SG280HN2F43E1VG. Our team will provide availability and support details to help you specify this device into your design.

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