1SG280HN1F43I1VGAS
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 92 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280HN1F43I1VGAS – Stratix® 10 GX FPGA, 2,800,000 logic elements, 688 I/Os, 1760-BBGA
The Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) 1SG280HN1F43I1VGAS is a high-density, industrial-grade FPGA designed for demanding bandwidth and compute applications. Built on the Stratix 10 GX family architecture, this device integrates a large programmable fabric alongside high I/O count and significant on-chip memory to address advanced networking, telecom, and data-accelerator use cases.
Key value propositions include a large logic capacity, extensive embedded RAM, broad I/O availability, and support for industry-leading Stratix 10 family innovations as documented in the device overview.
Key Features
- Programmable Logic Capacity — 2,800,000 logic elements provide substantial resources for complex digital designs and large-scale system integration.
- Embedded Memory — 240,123,904 total RAM bits for large buffers, on-chip data structures, and memory-intensive algorithms.
- I/O Density — 688 user I/O pins to support wide parallel interfaces, multi-lane SERDES front ends, and extensive peripheral connectivity.
- Power and Supply — Core voltage supply range 770 mV to 970 mV to match targeted power delivery and core performance operating points.
- Thermal and Environmental — Industrial operating temperature range from −40 °C to 100 °C for robust deployment in temperature-challenging environments.
- Package — 1760-ball BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package for high-pin-count board designs.
- Family Innovations (Stratix 10) — Architecture-level features from the Stratix 10 GX family include the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology as described in the device overview.
- Compliance — RoHS compliant.
Typical Applications
- High‑End Networking & Telecom — Use the device for line cards, switches, and backplane interfacing where high I/O count and large on-chip memory are required.
- Data Center Acceleration — Implement packet processing, protocol offload, or custom hardware acceleration leveraging the large logic fabric and RAM capacity.
- High‑Performance Computing & DSP — Deploy compute-intensive kernels and streaming workloads that benefit from extensive logic resources and embedded memory.
- Industrial Systems — Suitable for industrial automation and instrumentation that require industrial-grade temperature range and high integration.
Unique Advantages
- Large-Scale Programmability: 2.8 million logic elements enable consolidation of multiple functions into a single device, reducing board-level BOM and interconnect complexity.
- Substantial On-Chip Memory: 240,123,904 RAM bits support deep buffering and on-chip data structures, improving throughput and latency for streaming applications.
- High I/O Capacity: 688 I/Os provide flexibility for wide parallel buses, multiple transceiver lanes, and dense peripheral interfaces without external multiplexing.
- Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsher environments where thermal resilience matters.
- High‑Pin‑Count Package: 1760-ball FBGA (42.5 × 42.5 mm) gives designers access to the device’s full resource set while supporting professional PCB routing strategies.
- Family-Level Performance and Efficiency: Benefits from Stratix 10 family innovations documented in the device overview, including advanced core architecture and FinFET process technology.
Why Choose 1SG280HN1F43I1VGAS?
1SG280HN1F43I1VGAS positions itself as a high-capacity, industrial-grade FPGA option for system designers needing extensive logic resources, large embedded RAM, and broad I/O in a single package. Its specifications make it suitable for demanding networking, compute acceleration, and industrial control applications where integration and thermal range are important.
Choosing this Stratix 10 GX device provides access to the Stratix 10 family architectural advantages while delivering a packaged solution (1760-FBGA) that supports high-density board designs and RoHS compliance for modern production requirements.
Request a quote or submit an inquiry to learn about availability, pricing, and integration support for 1SG280HN1F43I1VGAS.

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