1SG280HN1F43E2VG

The 1SG280HN1F43E2VG is an Intel Stratix® 10 GX FPGA in a 1760‑BBGA FCBGA package, offering a large programmable fabric and high‑density I/O for demanding compute and connectivity applications. Built on the Stratix 10 family innovations, this device leverages the Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate (FinFET) technology to deliver enhanced core performance and energy efficiency for advanced networking, compute acceleration, and high‑speed communications designs.

This extended‑grade, surface‑mount device combines 2,800,000 logic elements, extensive on‑chip RAM, and high‑speed I/O to address systems that require high bandwidth, deep on‑chip memory, and flexible DSP resources while operating within a 0 °C to 100 °C range and a core voltage window of 770 mV to 970 mV.

Key Features

• Programmable Fabric — 2,800,000 logic elements for large, complex logic implementations and system-level integration.
• On‑Chip Memory — 240,123,904 total RAM bits for extensive buffering, packet processing, and data staging on the device.
• High‑Density I/O — 688 general I/O pins to support wide parallel interfaces and board‑level connectivity.
• High‑Performance Architecture — Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate (FinFET) process, delivering series‑level improvements in core performance and power efficiency.
• Advanced Transceiver and IP Ecosystem (Series Features) — Stratix 10 family features include heterogeneous 3D SiP transceiver tiles, multi‑Gbps transceiver capabilities, hard PCIe Gen3 IP, and hard 10G Ethernet IP to support high‑bandwidth data paths and protocol offload.
• DSP and Compute — Variable precision DSP blocks and hard floating‑point support (series‑level) for high‑throughput signal processing and compute acceleration workloads.
• Package & Mounting — 1760‑BBGA (FCBGA) surface‑mount package; supplier device package dimension: 1760‑FBGA (42.5 × 42.5 mm).
• Power and Temperature — Core supply range 770 mV to 970 mV; operating temperature range 0 °C to 100 °C; RoHS compliant and extended grade.

Typical Applications

• High‑Performance Networking — Use the large fabric, on‑chip memory, and high‑speed transceiver capabilities to implement packet processing, switching, and protocol acceleration.
• Data Center Acceleration — Implement custom compute kernels, compression, or encryption accelerators that require deep on‑chip RAM and substantial DSP resources.
• Telecommunications and Backplane Systems — Leverage the device’s high I/O count and series transceiver features for backplane interfaces and multi‑lane communications.
• Signal Processing and Test Equipment — Deploy variable‑precision DSP blocks and extensive RAM for high‑throughput signal processing, filtering, and measurement applications.

Unique Advantages

• Massive Logic Capacity: 2,800,000 logic elements enable consolidation of multiple subsystems into a single FPGA, reducing board complexity.
• Large On‑Chip Memory: 240,123,904 total RAM bits support deep buffering and high‑performance data flows without relying solely on external memory.
• Extensive I/O Density: 688 I/O pins provide flexibility for parallel interfaces, wide buses, and mixed‑signal board integration.
• Advanced Series Architecture: Stratix 10 family innovations—Hyperflex core, 14 nm FinFET, and SiP transceiver tiles—bring enhanced performance and energy efficiency to system designs.
• Surface‑Mount, High‑Density Package: 1760‑BBGA FCBGA (42.5 × 42.5 mm) package supports high pin count and board‑level routing for complex systems.
• Designed for Robust Operation: Extended grade and RoHS compliance with an operating range of 0 °C to 100 °C and defined core voltage range simplify system thermal and power planning.

Why Choose 1SG280HN1F43E2VG?

The 1SG280HN1F43E2VG positions itself for designs that demand a high‑capacity programmable fabric, abundant on‑chip memory, and dense I/O in a single device. Its Stratix 10 GX lineage brings architecture and process innovations that target higher core performance and improved power efficiency for bandwidth‑intensive and compute‑heavy applications.

This device is well suited to engineers building advanced networking, data center acceleration, telecom, and signal processing systems who need a scalable, high‑performance FPGA backed by the Stratix 10 family feature set and documentation.

Request a quote or submit a procurement inquiry to assess availability, pricing, and lead times for this Stratix 10 GX FPGA part. Our team can provide configuration and sourcing details to support your design schedule.