1SG280HN1F43E2LGS3

The 1SG280HN1F43E2LGS3 is an Intel Stratix® 10 GX FPGA device in a 1760-ball BGA package designed for high-density programmable logic and system integration. It combines a large logic fabric with significant on-chip RAM and a high I/O count to address advanced data processing, networking, and compute-accelerated applications.

As part of the Stratix 10 GX family, the device leverages the family’s Hyperflex core architecture and Intel 14 nm tri-gate process innovations to deliver performance and power advantages for demanding embedded and communications designs.

Key Features

• Logic Capacity 2,800,000 logic elements provide substantial programmable fabric for complex digital designs and large-scale custom logic integration.
• On‑Chip Memory 240,123,904 total RAM bits enable large buffer and caching implementations directly on the FPGA fabric.
• I/O and Package 688 user I/O pins in a 1760-BBGA (1760-FBGA, 42.5×42.5 mm) package suitable for dense board-level routing and high-pin-count system requirements. Surface-mount mounting type.
• Power and Supply Core voltage supply range of 820 mV to 880 mV for low-voltage core operation.
• Operating Temperature Extended-grade device rated for 0 °C to 100 °C operating temperature.
• Family Architecture Based on Intel Stratix 10 GX family innovations such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate technology, offering improved core performance and power efficiency compared with previous-generation high-performance FPGAs.
• Compliance RoHS compliant for regulatory environmental requirements.

Typical Applications

• High‑Performance Networking Large logic capacity and high I/O count support packet processing, switching, and custom protocol offload in networking and telecom equipment.
• Data Center Acceleration On-chip RAM and extensive logic resources enable hardware acceleration for data-path processing, encryption, and custom compute kernels.
• High‑Bandwidth Signal Processing Substantial RAM and logic elements accommodate buffering and complex DSP pipelines for communications and instrumentation systems.
• Prototype and Production FPGA Systems Dense packaging and extended temperature capability fit advanced prototype platforms and deployed systems requiring scalable programmable logic.

Unique Advantages

• Large, Integrated Fabric: 2.8 million logic elements combined with 240 million bits of on-chip RAM reduce external memory dependence and simplify system architecture.
• High I/O Density: 688 I/O pins in a 1760-ball FCBGA package enable complex board-level interfaces and broad connectivity options.
• Low‑Voltage Core: 820–880 mV supply range supports efficient core operation for power-sensitive designs.
• Extended Temperature Range: Rated for 0 °C to 100 °C operation to meet a range of deployed environmental conditions.
• Family-Level Performance Innovations: Leverages Stratix 10 GX family features such as the Hyperflex core architecture and 14 nm tri-gate process to deliver improved performance and power characteristics versus prior generations.
• RoHS Compliant: Meets environmental compliance requirements for lead-free manufacturing.

Why Choose 1SG280HN1F43E2LGS3?

This Stratix 10 GX device is positioned for engineers and system designers who need substantial programmable logic, large on-chip memory, and a high I/O count in a single, surface-mount package. It is well suited for high-throughput, compute- and I/O-intensive designs where consolidating functionality into the FPGA fabric reduces BOM complexity and improves system integration.

Backed by the Stratix 10 GX family architecture and documentation, the 1SG280HN1F43E2LGS3 offers a scalable platform for advanced networking, data-center acceleration, and signal-processing projects that require sustained performance and a high level of integration.

Request a quote or submit a pricing and availability inquiry to evaluate the 1SG280HN1F43E2LGS3 for your next high-performance FPGA design.