1SG280HN1F43E2VGAS

The Intel Stratix® 10 GX FPGA 1SG280HN1F43E2VGAS is a high-density, high-performance programmable device in a 1760-BBGA (FCBGA) package. Built on the Stratix 10 family and Intel Hyperflex™ core architecture, this device targets advanced applications that require large logic capacity, abundant on-chip memory, and extensive I/O.

With 2,800,000 logic elements and 240,123,904 bits of embedded RAM, this Stratix 10 GX FPGA is suited for demanding compute and connectivity tasks in data center, communications, and high-bandwidth signal processing systems while operating within a 770 mV to 970 mV core supply window.

Key Features

• Core Architecture  Intel Hyperflex™ core architecture on the Stratix 10 family foundation, delivering a high-performance programmable fabric optimized for complex logic integration.
• Logic Density  2,800,000 logic elements to map large, parallel logic designs and advanced processing pipelines.
• Embedded Memory  240,123,904 total RAM bits provide substantial on-chip storage for buffers, lookup tables, and intermediate datasets.
• I/O Capability  688 I/Os to support wide parallel interfaces, multi-protocol connectivity, and dense board-level routing.
• Power and Supply  Core voltage window from 770 mV to 970 mV, enabling low-voltage operation consistent with modern high-performance FPGA power domains.
• Package & Mounting  1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package for high-density board integration.
• Operating Range & Grade  Extended grade with operating temperature from 0 °C to 100 °C, suitable for a wide set of commercial and industrial environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-Performance Networking  Use the large logic fabric and abundant I/O to implement packet processing, switching, and protocol acceleration for data center and telecom equipment.
• Data Center Acceleration  Deploy on-chip memory and parallel logic for custom compute offloads, packet inspection, and algorithm acceleration.
• Signal Processing  Leverage dense logic and large RAM for real-time digital signal processing pipelines in communications and instrumentation systems.
• Custom ASIC Replacement / Prototyping  Implement complex system architectures and test silicon-proven IP in a high-density programmable fabric prior to ASIC development.

Unique Advantages

• High Logic Capacity: 2.8 million logic elements enable integration of large, multi-function designs on a single device.
• Substantial On‑Chip Memory: Over 240 million bits of embedded RAM reduce dependence on external memory and improve throughput for buffer- and state-intensive designs.
• Extensive I/O Count: 688 I/Os allow flexible interfacing to high-pin-count peripherals, mezzanine connectors, and multi-lane interconnects.
• Compact High-Density Package: 1760-FBGA (42.5 × 42.5 mm) keeps board footprint efficient while supporting the device’s pin count and thermal needs.
• Low-Voltage Core Operation: 770–970 mV supply range supports modern power-optimized system architectures.
• Extended Temperature Grade: 0 °C to 100 °C rating supports a broad range of commercial and industrial ambient conditions.

Why Choose 1SG280HN1F43E2VGAS?

The 1SG280HN1F43E2VGAS Stratix 10 GX FPGA combines large logic density, substantial embedded memory, and high I/O count in a single FCBGA package to address demanding applications that require on-board compute and high-throughput interfacing. It leverages Intel’s Stratix 10 family innovations and Hyperflex core architecture to deliver a programmable platform suited to complex networking, acceleration, and signal-processing tasks.

This device is appropriate for engineering teams needing a scalable, high-density FPGA solution with defined electrical and thermal characteristics, RoHS compliance, and a clear specification set for integration into advanced electronic systems.

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