1SG280HN1F43E2VGS3

The 1SG280HN1F43E2VGS3 is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 1760-ball BGA package. This extended-grade, surface-mount device integrates a high-density FPGA fabric with a large on-chip memory footprint and a high I/O count for demanding digital designs.

Designed for advanced applications that require significant logic capacity, on-chip RAM, and large I/O connectivity, the device delivers the combination of scalability and integration needed for high-bandwidth communications, compute acceleration, and complex digital signal processing tasks.

Key Features

• Logic Capacity — 2,800,000 logic elements (cells) to implement large-scale digital designs and complex algorithms.
• On-chip Memory — 240,123,904 total RAM bits, providing substantial embedded SRAM for buffering, packet processing, and data staging.
• I/O Density — 688 user I/O pins to support extensive external interfaces and high-channel-count connectivity.
• Package and Mounting — 1760-BBGA (1760-FBGA supplier package, 42.5 × 42.5 mm) in a surface-mount format for compact board integration.
• Power Supply — Core voltage range of 770 mV to 970 mV to match system power domains and PLL requirements.
• Temperature and Grade — Extended-grade device with an operating temperature range of 0°C to 100°C suitable for many commercial and enterprise applications.
• Compliance — RoHS-compliant manufacturing status.
• Stratix 10 GX Family Innovations — Built on the Stratix 10 GX family platform, which incorporates the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate process technologies to address higher performance and efficiency needs at the family level.

Typical Applications

• High‑Bandwidth Networking — Implement packet processing, switching logic, and protocol offload functions that require high logic density and large on-chip memory.
• Data Center Acceleration — Deploy custom compute kernels and data-path acceleration where large logic resources and abundant RAM bits support complex algorithms and buffering.
• Telecommunications & Backplane Interfaces — Use the device’s high I/O count to connect multiple high-speed PHYs and support modular board topologies.
• Signal Processing — Implement variable-precision DSP and custom filters leveraging the device’s extensive logic and memory resources for throughput-intensive workloads.

Unique Advantages

• Large-Scale Logic Integration: 2.8M logic elements enable consolidation of multiple functions into a single FPGA, reducing system bill of materials.
• Substantial Embedded Memory: 240,123,904 RAM bits provide on-chip capacity for packet queues, buffers, and scratch storage, minimizing external memory dependence.
• High I/O Count: 688 I/O pins simplify multi-lane interfaces and direct connections to peripherals without extensive multiplexing.
• Compact FCBGA Package: 1760-ball FBGA (42.5 × 42.5 mm) offers a dense form factor for space-constrained, high-performance boards.
• Controlled Power Domain: 770–970 mV supply range supports integration into low-voltage core domains common in modern FPGA power architectures.
• Extended Operating Grade: Specified 0°C to 100°C operation for deployments across a broad set of commercial and enterprise environments.

Why Choose 1SG280HN1F43E2VGS3?

This Stratix® 10 GX device combines very large logic capacity, substantial on-chip RAM, and a high I/O complement in a compact BGA package. It is positioned for designs that require significant programmable fabric, available memory bandwidth on-chip, and dense external connectivity while maintaining a controlled thermal and power envelope.

For design teams building networking, compute-acceleration, or signal-processing systems, the 1SG280HN1F43E2VGS3 offers a scalable, integrated platform aligned with the Stratix 10 GX family innovations to support performance and integration goals over the product lifecycle.

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