1SG280HN1F43I2LG

The 1SG280HN1F43I2LG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package. It leverages Stratix 10 family innovations—including the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process—to deliver high-performance programmable logic for demanding industrial applications.

With 2,800,000 logic elements, 240,123,904 bits of on-chip RAM and 688 I/O, this device targets systems that require large logic capacity, significant on-chip memory and high I/O density while operating across an industrial temperature range.

Key Features

• Core Architecture: Built on the Intel Stratix 10 GX family innovations including the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) process, delivering enhanced core performance for compute-intensive designs.
• Logic Capacity: 2,800,000 logic elements for complex digital designs and high-density logic integration.
• On-chip Memory: 240,123,904 total RAM bits and support for M20K internal SRAM memory blocks for large buffering and state storage.
• I/O and Packaging: 688 I/O pins in a 1760-FBGA surface-mount package (42.5 × 42.5 mm) to support wide external connectivity and board-level integration.
• Power and Supply: Core voltage supply range of 820 mV to 880 mV to match low-voltage FPGA core domains.
• Thermal and Grade: Industrial grade device rated for operation from -40°C to 100°C for use in temperature-demanding environments.
• Compliance: RoHS compliant.

Typical Applications

• High-performance networking and communications: Large logic capacity and extensive I/O make this FPGA suitable for packet processing, protocol offload and high-bandwidth system designs.
• Data center acceleration: Substantial on-chip RAM and logic elements support custom acceleration of compute and data-path functions.
• Telecom and backplane systems: The package density and I/O count enable integration into high-density boards and modular systems.

Unique Advantages

• High logic density: 2.8 million logic elements enable consolidation of complex functions into a single device, reducing system BOM and board area.
• Large on-chip memory: 240,123,904 bits of RAM support extensive buffering, large lookup tables and state storage without external memory.
• Extensive I/O capability: 688 I/O pins in a compact 1760-FBGA package provide flexibility for diverse interface requirements and high pin-count systems.
• Industrial temperature range: Rated from -40°C to 100°C for deployment in temperature-challenging environments.
• Low-voltage core: 820 mV–880 mV core supply supports modern low-voltage designs and power-optimized system architectures.
• Standards-friendly platform: Based on the Stratix 10 GX family architecture, which includes features relevant to high-performance transceivers, DSP and memory subsystems.

Why Choose 1SG280HN1F43I2LG?

The 1SG280HN1F43I2LG is positioned for engineers who need large programmable logic capacity, substantial on-chip memory and high I/O density in an industrial-grade FPGA. Its Stratix 10 GX family foundation offers architectural advantages for compute- and bandwidth-intensive designs while the 1760-FBGA package enables dense board integration.

Choose this device for scalable, high-performance FPGA implementations where logic density, memory capacity and robust thermal tolerance drive system-level value. The combination of device-level specifications supports long-term design flexibility and integration into demanding industrial and communications applications.

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