1SG280HN1F43I1VG

The 1SG280HN1F43I1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA FCBGA package. It implements the Stratix 10 family architecture and series-level innovations to address high-bandwidth, high-performance digital designs.

This device provides large programmable logic capacity and on-chip RAM with extensive I/O in an industrial-grade, surface-mount package, making it suitable for demanding communications, compute and networking applications that require scalable logic, memory and I/O resources.

Key Features

• Core architecture  Intel Stratix 10 family innovations including the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) technology are part of the series design noted in the device overview.
• Logic capacity  2,800,000 logic elements (Number Of Logic Elements Cells: 2800000) for large-scale programmable logic integration.
• On‑chip memory  240,123,904 total RAM bits of embedded memory to support large buffering, packet processing and data-path storage requirements.
• I/O and package  688 user I/Os and a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) FCBGA package; surface-mount mounting simplifies board-level assembly for dense designs.
• Power and operating range  Core voltage range 770 mV to 970 mV and industrial operating temperature range −40 °C to 100 °C, suitable for extended-temperature deployments.
• Series-level transceiver and DSP capabilities  Stratix 10 family features include high-speed transceivers and variable-precision DSP blocks (series overview lists up to 96 transceiver channels and high DSP throughput), enabling high-bandwidth serial links and heavy signal processing where applicable.

Typical Applications

• High‑performance networking  Packet processing, switching and line-card implementations that require large logic capacity, on-chip memory and extensive I/O.
• Data center acceleration  Hardware acceleration for compute and storage offload where dense logic and memory resources are used to implement custom data paths and algorithms.
• Telecommunications  Backplane, module and protocol processing applications that benefit from series transceiver capabilities and high I/O counts.
• Test and measurement  Custom instrumentation and data acquisition systems that require programmable logic, large embedded RAM and industrial temperature operation.

Unique Advantages

• Large programmable fabric  2.8 million logic elements deliver the capacity to implement complex and highly parallel designs on a single device.
• Substantial on‑chip RAM  Over 240 million bits of embedded RAM reduce dependence on external memory for buffering and on-chip data storage.
• High I/O density in a compact package  688 I/Os in a 1760-BBGA FCBGA (42.5 × 42.5 mm) package provide a balance of connectivity and board-area efficiency.
• Industrial temperature rating  Rated for −40 °C to 100 °C operation to support extended-temperature system designs.
• Series-level performance and power innovations  Stratix 10 family innovations such as the Hyperflex core architecture and FinFET process technology provide the foundation for higher core performance and power efficiency referenced in the series overview.

Why Choose 1SG280HN1F43I1VG?

This Stratix® 10 GX device combines very large logic capacity, substantial on-chip RAM and high I/O density in an industrial-grade FCBGA package, making it well-suited for advanced networking, compute acceleration and telecommunications designs. The device leverages Stratix 10 series architecture innovations to deliver a platform optimized for demanding bandwidth and processing requirements.

Designers who need scalable, high-capacity programmable logic with robust temperature and voltage operating ranges will find this part suitable for systems that require integration of large logic functions, memory-intensive data paths and dense external connectivity.

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