1SG280HN1F43I2LGAS

The 1SG280HN1F43I2LGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) packaged in a 1760-BBGA (42.5 × 42.5 mm) surface-mount package. It delivers very high logic density and on-chip memory to support designs that require extensive programmable logic, large embedded RAM, and extensive I/O.

Built on Intel’s Stratix 10 family architecture and Intel 14 nm tri-gate (FinFET) technology with the Hyperflex core architecture, this device targets applications that demand increased processing performance, high bandwidth I/O, and industrial-temperature operation.

Key Features

• Logic Capacity  2,800,000 logic elements providing large programmable fabric for complex RTL implementations and custom accelerators.
• On-Chip Memory  240,123,904 total RAM bits for substantial internal buffering, caching, and memory-intensive use cases.
• High I/O Count  688 user I/Os to support wide parallel interfaces and dense connectivity to external devices and mezzanine modules.
• Advanced Process and Core Architecture  Built on Intel 14 nm tri-gate (FinFET) process and Intel Hyperflex core architecture to enable higher core performance as described for the Stratix 10 family.
• Transceiver and High‑Speed Capability (Family Features)  Stratix 10 family innovations include heterogeneous 3D SiP transceiver tiles and high-speed transceiver technology for demanding bandwidth requirements.
• Package and Mounting  1760-BBGA FCBGA package (42.5 × 42.5 mm) optimized for surface-mount PCB assembly and dense system integration.
• Power Supply  Core voltage supply range: 820 mV to 880 mV.
• Operating Range  Industrial operating temperature from −40°C to 100°C.
• Compliance  RoHS compliant.

Typical Applications

• High-bandwidth networking: Use the device's high logic density and family-level transceiver capabilities to implement packet processing, switch fabric, and protocol engines.
• Data center acceleration: Implement custom accelerators and offload engines that require large on-chip RAM and extensive logic.
• High-performance compute and signal processing: Support DSP-heavy workloads and complex algorithms leveraging the Stratix 10 family architecture.
• Industrial systems: Deploy in industrial-temperature environments where wide operating range and robust packaging are required.

Unique Advantages

• High logic density: 2.8 million logic elements enable large-scale FPGA designs and complex custom logic integration on a single device, reducing board-level complexity.
• Large on-chip RAM: Over 240 million bits of embedded RAM support deep buffering, large lookup tables, and memory-intensive algorithms without relying on external memory.
• Extensive I/O  688 I/Os provide broad interface flexibility for parallel buses, numerous peripherals, or multi-lane link implementations.
• Industrial temperature rating: −40°C to 100°C operating range suits demanding environmental conditions and industrial deployments.
• Modern process and architecture: Intel 14 nm FinFET process combined with Hyperflex core architecture (Stratix 10 family) provides the performance characteristics described for the family.
• Compact, manufacturable package: 1760-BBGA (42.5 × 42.5 mm) surface-mount package simplifies high-density PCB design and assembly.

Why Choose 1SG280HN1F43I2LGAS?

The 1SG280HN1F43I2LGAS positions itself where very high logic capacity, substantial on-chip RAM, and a large I/O matrix are required within an industrial-temperature, surface-mount form factor. It is suited to engineering teams building high-bandwidth, compute-intensive FPGA designs that benefit from the Stratix 10 family’s architectural advances and Intel’s 14 nm FinFET process.

Choosing this device offers a path to consolidate complex functions into a single programmable device—reducing system BOM, simplifying board routing, and leveraging family-level high-speed transceiver and timing innovations documented for the Stratix 10 GX family.

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