1SG280HN2F43E1VGS3

The 1SG280HN2F43E1VGS3 is an Intel Stratix® 10 GX family FPGA optimized for high‑performance logic and high‑density I/O integration. Built on the Stratix 10 architecture, the device leverages the family’s Hyperflex core innovations and Intel 14 nm tri‑gate (FinFET) process to address demanding applications that require large logic capacity, extensive on‑chip memory, and high‑speed transceiver capability.

This extended‑grade, surface‑mount device targets markets that need scalable programmable logic with substantial RAM and I/O resources, delivering a combination of processing density, advanced fabric architecture, and heterogeneous transceiver support suitable for networking, compute acceleration, and high‑speed communications systems.

Key Features

• Core architecture  Based on Intel Stratix 10 family innovations including the Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) process for improved core performance.
• Logic density  2,800,000 logic elements (LEs) to support complex programmable logic designs and large FPGA implementations.
• On‑chip memory  240,123,904 total RAM bits of embedded memory for buffering, packet processing, and on‑chip data storage.
• I/O and connectivity  688 user I/O pins to support broad external interfacing and multi‑lane high‑speed connections.
• Transceiver and DSP family capabilities  Stratix 10 family transceiver and DSP innovations (family‑level) support high data‑rate serial links and variable‑precision DSP processing for signal and protocol processing workloads.
• Power supply  Supports core supply in the range of 770 mV to 970 mV to match system power architectures.
• Package and mounting  1760‑BBGA (FCBGA) package, supplier device package 1760‑FBGA (42.5 × 42.5 mm); surface‑mount design for board‑level assembly.
• Operating range and grade  Extended grade with an operating temperature range of 0 °C to 100 °C and RoHS compliance.

Typical Applications

• High‑performance networking  Packet processing, switch/router line cards and backplane interfaces that require large logic capacity, on‑chip RAM, and numerous I/O signals.
• Data center acceleration  Compute and acceleration modules leveraging extensive logic and memory resources to implement custom accelerators and protocol offload.
• High‑speed communications  Systems using family transceiver capabilities and high I/O counts for multi‑lane serial links and protocol bridging.
• Signal processing and DSP  Applications that benefit from the family’s variable‑precision DSP capabilities and large embedded memory for streaming and real‑time processing.

Unique Advantages

• High logic capacity: 2.8 million logic elements enable large, complex designs or extensive parallelism without partitioning across multiple devices.
• Substantial on‑chip RAM: 240,123,904 total RAM bits provide deep buffering and memory resources for data‑intensive operations.
• Extensive I/O: 688 I/O pins support dense external connectivity and complex board‑level interfacing.
• Advanced package: 1760‑BBGA (FCBGA) with a 42.5 × 42.5 mm supplier package footprint simplifies high‑density assembly while supporting the device’s thermal and pinout requirements.
• Controlled power range: Core supply support from 770 mV to 970 mV allows integration into modern low‑voltage power domains.
• Extended operating grade: Qualified for 0 °C to 100 °C operation to meet a range of system‑level thermal environments.

Why Choose 1SG280HN2F43E1VGS3?

The 1SG280HN2F43E1VGS3 positions itself as a high‑capacity, high‑I/O FPGA from the Intel Stratix 10 GX family, delivering the logic density and on‑chip memory required for complex, data‑intensive designs. Its family heritage brings architectural improvements and transceiver/DSP capabilities that align with networking, compute acceleration, and high‑speed communications use cases.

Design teams seeking a scalable, programmable platform with substantial logic, memory, and I/O resources will find this device suitable for systems that demand integrated, high‑performance programmable logic within an extended operating range and a compact, surface‑mount BBGA package.

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