1SG280HN1F43E2LG

The 1SG280HN1F43E2LG is an Intel Stratix® 10 GX field-programmable gate array (FPGA) packaged in a 1760-BBGA (FCBGA) footprint. It combines a high logic capacity with extensive I/O and on-chip RAM to address advanced processing and bandwidth-intensive designs.

Built on the Stratix 10 family architecture, the device leverages the family’s Hyperflex core approach and 14 nm tri-gate technology to deliver the performance and integration needed for demanding applications such as high-bandwidth networking, data acceleration, and communications infrastructure.

Key Features

• Core & Architecture Intel Stratix 10 family architecture with Hyperflex core design as described in the device overview; provides the architectural foundation for high-performance FPGA implementations.
• Logic Capacity 2,800,000 logic elements, supporting large, complex designs and significant custom logic integration.
• On‑Chip Memory 240,123,904 total RAM bits for packet buffering, lookup tables, and other memory-intensive functions.
• I/O & Packaging 688 I/O pins in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm supplier package) suitable for dense board-level integration and high-pin-count system interconnect.
• Power Core voltage supply range of 820 mV to 880 mV, enabling low-voltage core operation consistent with high-density FPGA fabrics.
• Thermal & Grade Extended grade device with an operating temperature range of 0 °C to 100 °C for deployment in many commercial and enterprise environments.
• Mounting & Compliance Surface-mount FCBGA package; RoHS compliant.

Typical Applications

• High‑Bandwidth Networking Use the device’s large logic capacity and abundant I/O to implement packet processing, switching/routing logic, and line-rate protocol engines.
• Data Center Acceleration Implement custom data-path acceleration, offload engines, and buffering using the device’s large RAM and logic resources.
• Telecommunications Infrastructure Deploy for backplane and module-level protocol handling where high I/O count and dense logic are required.
• High‑Performance Compute & Signal Processing Leverage the fabric’s compute resources and memory to implement large-scale DSP and algorithm pipelines.

Unique Advantages

• High Logic Density: 2.8 million logic elements allow consolidation of multiple functions into a single FPGA, reducing system BOM and board area.
• Large On‑Chip Memory: Over 240 million bits of RAM support heavy buffering and stateful processing without external memory dependence for many use cases.
• Extensive I/O Connectivity: 688 I/Os in a compact 1760‑BBGA package enable complex I/O interfaces and high pin-count interconnects on dense PCBs.
• Low‑Voltage Core: 820–880 mV core supply supports modern low-voltage FPGA operation and power-optimized designs.
• Extended‑Grade Operation: Rated for 0 °C to 100 °C operation to meet the thermal requirements of many commercial and enterprise environments.

Why Choose 1SG280HN1F43E2LG?

The 1SG280HN1F43E2LG positions itself for customers needing high logic capacity, large on-chip memory, and extensive I/O in a single, surface-mount FPGA package. Its Stratix 10 family architecture and Hyperflex-based core provide the foundation for demanding bandwidth and processing applications while the extended-grade rating and RoHS compliance support a wide range of commercial deployments.

This device is well suited for engineers designing complex networking, compute-acceleration, and telecom systems who require scalable logic resources, significant embedded RAM, and a compact high-pin-count package for board-level integration.

Request a quote or submit an inquiry to discuss availability, lead times, and board-level integration support for the 1SG280HN1F43E2LG.