1SG280HH3F55I3XG

The Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) 1SG280HH3F55I3XG is a high‑density, industrial‑grade FPGA featuring a modern Hyperflex core architecture and the performance attributes of the Stratix 10 GX family. This device combines 2,800,000 logic elements with extensive on‑chip memory and large I/O counts to address advanced applications that require high bandwidth, complex signal processing, and large programmable fabric.

Built for surface‑mount PCB assembly in a 2912‑BBGA (55×55) package, the device supports low‑voltage core operation and wide operating temperature range suitable for demanding environments.

Key Features

• Core Logic  2,800,000 logic elements (cells) provide a large programmable fabric for complex custom logic and DSP implementations.
• On‑Chip Memory  240,123,904 total RAM bits for LUTRAM and embedded memory that support large buffering, packet processing, and state storage.
• I/O Capacity  1,160 I/Os to support extensive high‑density board connectivity and multiple parallel interfaces.
• Package & Mounting  2912‑BBGA (FCBGA) package in a 55×55mm footprint; surface‑mount mounting type suitable for compact, high‑pin‑count layouts.
• Power and Supply  Core voltage supply range of 820 mV to 880 mV for low‑voltage operation consistent with Stratix 10 GX core requirements.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for reliable operation in a wide set of environments.
• Stratix 10 Family Innovations  Based on Intel’s Stratix 10 GX family technology: Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate (FinFET) process for improved core performance and efficiency (family‑level characteristics).
• Advanced Transceiver and IP (Family‑level)  Stratix 10 GX family includes heterogeneous 3D SiP transceiver tiles and hard IP for high‑speed interfacing such as PCIe and 10G Ethernet (refer to family documentation for specific channel and IP availability).

Typical Applications

• High‑Speed Networking & Switching  Use the device’s dense logic, large on‑chip RAM, and extensive I/O to implement packet processing, protocol offload, and switching fabrics.
• Telecom & Backplane Systems  Suitable for systems that require high bandwidth serial interfaces and large programmable logic capacity for framing, FEC, and protocol engines.
• Data Center Acceleration  Leverage the large logic count and embedded memory for custom acceleration of data‑intensive workloads and offload functions.
• High‑Performance Signal Processing  Implement complex DSP pipelines, buffering, and real‑time data manipulation using the device’s logic and on‑chip RAM resources.

Unique Advantages

• Large Programmable Fabric: 2.8 million logic elements enable significant custom logic integration and consolidation of multiple functions into a single device.
• Extensive On‑Chip Memory: 240,123,904 RAM bits provide capacity for deep buffering, large lookup tables, and stateful processing without external memory in many use cases.
• High I/O Count: 1,160 I/Os simplify board‑level partitioning and reduce the need for multiple devices to achieve required interface density.
• Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in thermally challenging environments.
• Compact, High‑Pin Package: 2912‑BBGA (55×55) package delivers very high pin density in a space‑efficient form factor for complex designs.
• Family‑Level Performance Architecture: Leveraging Stratix 10 GX family innovations (Hyperflex cores and 14 nm FinFET) provides a proven platform for high‑performance FPGA designs.

Why Choose 1SG280HH3F55I3XG?

The 1SG280HH3F55I3XG combines a very large logic element count, substantial embedded RAM, and a high I/O count in an industrial‑grade, surface‑mount BBGA package. It is positioned for engineers building bandwidth‑intensive, compute‑heavy systems that require extensive on‑chip resources and robust thermal operating range.

For projects that demand scalable programmable capacity, dense connectivity, and integration of complex signal processing or protocol logic, this Stratix 10 GX device delivers the headroom and platform characteristics to support long‑life, maintainable designs within the Stratix 10 family ecosystem.

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