1SG280HH3F55I2LG

The 1SG280HH3F55I2LG is an Intel Stratix® 10 GX field-programmable gate array (FPGA) delivered in a 2912-ball FCBGA package. It combines high logic capacity, extensive on-chip RAM, and a large I/O count to address demanding bandwidth and processing requirements.

Built on the Stratix® 10 family architecture, this device targets high-performance applications that require dense programmable logic, substantial embedded memory, and robust I/O connectivity while operating across an industrial temperature range.

Key Features

• Logic Capacity  Provides 2,800,000 logic elements for complex digital designs and high-density implementations.
• Embedded Memory  Includes 240,123,904 total RAM bits to support large on-chip buffering, packet processing, and data staging.
• I/O and Connectivity  Offers 1,160 I/O pins for extensive external interfacing and system-level integration.
• Family Innovations  Leverages Stratix® 10 family architecture elements such as the Intel Hyperflex core architecture and 14 nm FinFET technology (family-level features documented in the Stratix® 10 overview).
• Transceiver and Interface Capability (Family-Level)  Stratix® 10 family devices include high-speed transceiver and hard IP options such as PCIe and 10G Ethernet (refer to family documentation for specific transceiver configuration and availability).
• Power Supply  Core voltage operation specified between 820 mV and 880 mV for the device.
• Package and Mounting  Supplied in a 2912-BBGA (2912-FBGA, 55×55) surface-mount package for compact system placement.
• Environmental and Grade  Designed and specified to industrial grade with an operating temperature range of −40 °C to 100 °C. RoHS compliant.

Typical Applications

• High-Performance Networking  Large logic capacity and extensive I/O make this device suitable for packet processing, switching fabric, and network acceleration functions.
• Data Center and Compute Acceleration  Substantial on-chip RAM and logic resources support FPGA-based acceleration workloads and data-path offload tasks.
• High-Speed Serial and Protocol Processing  Stratix® 10 family transceiver and hard-IP capabilities support implementation of high-throughput serial protocols and protocol offload (see family documentation for available transceiver features).
• Embedded Processing and SoC Integration  Family-level SoC options and architecture features enable integration with processor subsystems and complex embedded applications (consult family documentation for SoC variant details).

Unique Advantages

• High Logic Density: 2,800,000 logic elements provide the headroom needed for large FPGA designs and advanced bitstream functionality.
• Large On-Chip Memory: 240,123,904 bits of RAM reduce external memory dependence and improve data throughput for buffering and packet manipulation.
• Extensive I/O Count: 1,160 I/Os enable broad system interfacing and flexible board-level connectivity.
• Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports deployment in industrial environments.
• Compact, High-Density Package: The 2912-ball FCBGA (55×55) package allows high integration density in space-constrained designs.
• Verified Compliance: RoHS compliance aligns the device with common regulatory and manufacturing requirements.

Why Choose 1SG280HH3F55I2LG?

The 1SG280HH3F55I2LG delivers a balance of large programmable logic capacity, significant embedded RAM, and extensive I/O in a single industrial-grade Stratix® 10 GX device. It is positioned for engineers designing high-throughput, compute-intensive systems that require on-chip memory and a high pin count within a compact FCBGA package.

As part of the Stratix® 10 family, this device benefits from documented family-level innovations and architecture features that support scalable designs and long-term platform deployment. Its industrial temperature rating and RoHS compliance make it suitable for demanding production environments.

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