1SG280HH3F55E3VG

The 1SG280HH3F55E3VG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) supplied in a 2912-BBGA FCBGA package. It combines a high logic capacity and large on-chip RAM with a broad I/O count for demanding, high-performance applications.

As part of the Stratix 10 GX family, this device incorporates the family’s core architectural innovations and is aimed at advanced applications that require significant processing bandwidth and integration while operating within a low-voltage core domain.

Key Features

• Large logic capacity  Provides 2,800,000 logic elements for complex, high-density designs and extensive programmable logic integration.
• On-chip memory  Includes 240,123,904 total RAM bits to support large buffering, packet processing, and intermediate data storage requirements.
• High I/O count  Offers 1,160 I/O pins to connect multiple high-speed interfaces, external memories, and peripherals.
• Core voltage  Operates with a supply range of 770 mV to 970 mV, suitable for the device’s low-voltage core architecture.
• Package and mounting  Supplied in a 2912-BBGA (2912-FBGA, FC 55×55) surface-mount package for compact board-level integration.
• Temperature and grade  Extended grade device rated for operation from 0 °C to 100 °C to meet a wide range of deployment environments.
• Standards compliance  RoHS compliant, supporting environmental and materials requirements for modern electronics manufacturing.

Typical Applications

• High-bandwidth networking  Used in systems that require large programmable logic capacity and extensive I/O to implement packet processing, switching, and protocol offload functions.
• Data center acceleration  Suitable for FPGA-based accelerators that leverage large on-chip RAM and dense logic for compute-intensive workloads.
• Telecommunications infrastructure  Provides the I/O and logic resources needed for line cards, backplane interfaces, and transceiver-rich subsystems.
• Signal processing and DSP  Large logic and memory resources support complex signal processing pipelines and buffering in communication and instrumentation equipment.

Unique Advantages

• Massive programmable fabric: 2.8 million logic elements enable highly parallel implementations and architectural consolidation.
• Substantial on-chip memory: 240,123,904 bits of RAM reduce dependence on external memory for many buffering and working-set needs.
• Extensive connectivity: 1,160 I/Os make it easier to integrate multiple high-speed interfaces and peripherals without external multiplexing.
• Compact, industry-standard packaging: 2912-BBGA (55×55) surface-mount package supports dense PCB designs while providing robust thermal and mechanical characteristics.
• Low-voltage core operation: 770 mV–970 mV supply range aligns with modern power-efficient FPGA core domains.
• Extended operating range and RoHS compliance: Rated 0 °C–100 °C and RoHS compliant for broad deployment and regulatory compatibility.

Why Choose 1SG280HH3F55E3VG?

The 1SG280HH3F55E3VG positions itself for designs that require significant programmable logic, large on-chip memory, and a high number of I/Os within a compact, surface-mount package. As a member of the Stratix 10 GX family, it leverages the family’s architecture and platform-level innovations to address advanced processing and bandwidth needs.

Engineers and system designers will find this device appropriate for high-performance networking, compute acceleration, and signal-processing applications where integration density, memory capacity, and flexible I/O are key selection criteria. Its extended-grade operating range and RoHS compliance support reliable deployment across a range of environments.

Request a quote or submit an inquiry to learn more about pricing, availability, and how the 1SG280HH3F55E3VG can fit into your next design.