1SG280HH3F55E2LG

The 1SG280HH3F55E2LG is a Stratix® 10 GX field programmable gate array (FPGA) in a 2912-BBGA FCBGA package, designed for high-bandwidth, high-performance applications. It leverages the Stratix 10 family architecture to deliver advanced core performance and integration for demanding signal processing, networking, and compute tasks.

This device provides a large fabric with 2,800,000 logic elements and extensive on-chip memory, plus 1,160 general-purpose I/Os, enabling complex system integration in a single FPGA. Its extended-grade qualification, defined voltage range, and surface-mount 2912-FBGA package make it suitable for deployment in robust system designs.

Key Features

• High-density Logic  2,800,000 logic elements for implementing large-scale digital designs and complex algorithms.
• On-chip Memory  240,123,904 total RAM bits to support large buffering, LUTs, and on-chip data storage for high-throughput applications.
• Extensive I/O  1,160 I/O pins to interface with multiple high-speed peripherals and system-level interconnects.
• Stratix 10 Architecture  Based on the Stratix 10 GX family innovations, including the Intel Hyperflex core architecture and 14 nm FinFET process as described in the device overview.
• Advanced Transceiver and IP Capabilities  Family-level features include high-speed transceivers, hard PCI Express and Ethernet IP blocks, and variable-precision DSP resources, as documented in the Stratix 10 GX/SX overview.
• Package & Mounting  2912-BBGA (2912-FBGA, 55×55) surface-mount package suitable for compact board-level integration.
• Power Supply Range  Core supply specified from 820 mV to 880 mV for the device core.
• Operating Conditions  Extended grade with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-performance Networking  Implement packet processing, switching, and PHY/PCS integration where large logic capacity and many I/Os are required.
• Data Center & Acceleration  Deploy logic- and memory-intensive acceleration functions that benefit from the device’s large on-chip RAM and DSP-oriented family features.
• Telecommunications Infrastructure  Use for backplane and module designs that require high-channel transceiver support and extensive I/O count.

Unique Advantages

• Large Fabric Integration: 2.8 million logic elements enable consolidation of multiple functions into a single FPGA, reducing system BOM and board complexity.
• Substantial On-chip Memory: Over 240 million RAM bits provide deep buffering and local data storage to minimize external memory dependence.
• High I/O Count: 1,160 I/Os simplify routing to external devices and support dense connector and daughtercard interfaces.
• Extended-grade Operation: Rated for 0 °C to 100 °C operation to meet elevated temperature requirements within non-automotive environments.
• Package Compatibility: 2912-FBGA (55×55) ball-grid package supports compact, high-density PCB layouts and surface-mount assembly.
• Verified Family Technologies: Benefits from the Stratix 10 GX family innovations such as Hyperflex core architecture and advanced transceiver/IP blocks as described in the device documentation.

Why Choose 1SG280HH3F55E2LG?

The 1SG280HH3F55E2LG positions itself as a high-capacity Stratix 10 GX FPGA option for designs that require substantial logic, memory, and I/O resources in a single device. Its combination of 2,800,000 logic elements, large on-chip RAM, and 1,160 I/Os supports consolidation of complex signal processing, networking, and compute functions.

Engineered within the Stratix 10 family framework, this device is appropriate for teams building advanced hardware platforms that need a scalable, high-performance FPGA with extended-grade operation and surface-mount package compatibility.

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