1SG280HH3F55E1VGS3

The 1SG280HH3F55E1VGS3 is an Intel Stratix® 10 GX field programmable gate array supplied in a 2912-ball FCBGA package (55×55). It pairs a high logic-element capacity with large on-chip RAM and extensive I/O to address advanced, high-throughput hardware designs.

As part of the Stratix 10 family, this device leverages the family’s core architecture and high-performance platform innovations to serve demanding applications that require dense logic, large embedded memory, and substantial I/O bandwidth while operating within a 0 °C to 100 °C range.

Key Features

• Core Architecture (family-level): Intel Hyperflex core architecture and 14 nm tri-gate technology are highlighted in the Stratix 10 family overview, supporting higher core performance and efficiency.
• Logic Density: 2,800,000 logic elements (logic element cells) for complex, high-density digital designs.
• Embedded Memory: 240,123,904 total RAM bits to store large datasets, buffers, and state for data-intensive processing.
• I/O Capacity: 1,160 user I/Os to support broad external interfacing and high-pin-count systems integration.
• Power Supply Range: Core voltage range of 770 mV to 970 mV to match system power design requirements.
• Package & Mounting: 2912-BBGA FCBGA (supplier package: 2912-FBGA, FC (55×55)); surface-mount mounting type for board-level assembly.
• Temperature Grade: Extended grade with an operating temperature range of 0 °C to 100 °C suitable for many industrial and commercial environments.
• Compliance: RoHS compliant.
• Family-Level I/O & Transceiver Capabilities: Stratix 10 family overview documents high-performance transceiver and interface features (for example, high-speed serial transceivers, PCI Express and Ethernet hard IP are described at the family level).

Typical Applications

• High‑Performance Networking: Implement network engines, packet processors, and line cards that require extensive logic, embedded memory, and many I/Os.
• Telecom & Data Center Infrastructure: Build backplane and switch fabrics leveraging the device’s high logic capacity and family-level transceiver capabilities for bandwidth-centric designs.
• Compute Acceleration: Deploy custom accelerators and data-path engines that use large on-chip RAM and dense logic to offload compute-intensive tasks.
• Advanced Prototyping and System Integration: Use the high I/O count and large logic/memory resources for complex SoC prototyping and heterogeneous system integration.

Unique Advantages

• High Logic Capacity: 2.8 million logic elements provide the resource headroom for large, complex FPGA designs without partitioning across multiple devices.
• Substantial On‑Chip Memory: Over 240 million RAM bits enable deep buffering, large lookup tables, and data staging within the FPGA fabric.
• Extensive I/O Reach: 1,160 I/Os allow flexible connectivity to high-pin-count peripherals, memory interfaces, and board-level interconnects.
• Robust Thermal and Power Envelope: Extended temperature grade (0 °C to 100 °C) and defined core voltage range (770 mV–970 mV) simplify system power and thermal planning.
• Industry‑Compliant Packaging: 2912-ball FCBGA (55×55) surface-mount package supports modern PCB assembly processes for high-density boards.
• Backed by Stratix 10 Family Innovations: Family-level features such as the Hyperflex core architecture and advanced transceiver/IP options offer a platform designed for high throughput and efficiency.

Why Choose 1SG280HH3F55E1VGS3?

The 1SG280HH3F55E1VGS3 positions itself as a high-capacity Stratix 10 GX FPGA option for designs that demand large logic resources, significant embedded RAM, and a high I/O count in a 2912-ball FCBGA package. It is suitable for engineers building bandwidth- and compute-intensive systems where on-chip resources and robust interfacing are critical.

Choosing this device provides access to the Stratix 10 family’s architectural advancements while delivering a defined operating range and RoHS compliance—making it a practical choice for long-lived, scalable hardware designs that leverage a high-performance FPGA platform.

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