1SG280HH3F55E2VG

The 1SG280HH3F55E2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2912-BBGA FCBGA package. It combines a high logic capacity with large on-chip memory and high I/O density for demanding programmable-logic designs.

Built on the Stratix 10 GX family architecture, the device benefits from innovations described for the family — including the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology — which the family documentation cites as delivering increased core performance and improved power efficiency over previous generations.

Key Features

• Core & architecture  Stratix 10 GX family innovations such as the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) process are part of the device family design referenced in the product documentation.
• Logic capacity  2,800,000 logic elements (logic cells) for complex, large-scale designs and high gate-count implementations.
• On-chip memory  240,123,904 total RAM bits to support large buffering, on-chip data storage, and stateful processing.
• I/O density  1,160 user I/Os to support dense connectivity and multiple high-pin-count interfaces.
• Power supply range  Specified core supply range of 770 mV to 970 mV to match modern core power domains.
• Package & mounting  2912-BBGA (2912-FBGA, FC 55×55) surface-mount package for high-pin-count, board-level designs.
• Operating temperature & grade  Extended grade with an operating temperature range of 0 °C to 100 °C for systems targeting extended commercial and server-class environments.
• Environmental compliance  RoHS compliant.

Typical Applications

• Data center acceleration  Large logic capacity and extensive on-chip RAM make the device suitable for custom acceleration and offload functions where programmable logic and memory bandwidth are required.
• Network and telecom infrastructure  High I/O count and family-level high-speed transceiver capabilities described in the Stratix 10 GX documentation support packet-processing, switching, and line-card designs.
• High-performance signal processing  Large embedded memory and massive logic resources enable complex DSP, filtering, and real-time data-path implementations.
• Prototype and complex system integration  The combination of logic, memory and I/O density supports multi-function prototypes and systems that integrate custom hardware accelerators with dense external interfaces.

Unique Advantages

• Large programmable fabric: 2,800,000 logic elements enable implementation of high-gate-count designs and extensive parallelism without immediate partitioning to multiple devices.
• Substantial on-chip memory: 240,123,904 RAM bits reduce dependence on external memory for buffering and intermediate storage, simplifying board-level memory architectures.
• High I/O count: 1,160 I/Os provide the pin budget needed for multi-lane interfaces, extensive control signals, and peripheral connectivity.
• Modern process advantages: Family-level use of 14 nm tri-gate (FinFET) technology supports improved performance-per-watt characteristics referenced in the device documentation.
• Compact, high-pin-count package: The 2912-BBGA surface-mount package delivers dense I/O in a 55×55 footprint for space-constrained, high-functionality PCBs.
• Extended-grade operation: Rated 0 °C to 100 °C for applications targeting extended commercial and server environments where broader-than-standard temperature operation is required.

Why Choose 1SG280HH3F55E2VG?

The 1SG280HH3F55E2VG combines very large logic capacity, significant on-chip RAM and a high I/O count in a compact 2912-BBGA package, making it well suited for complex compute, networking and signal-processing systems that require dense programmable resources. As a member of the Intel Stratix 10 GX family, it benefits from the family-level architecture optimizations and process technology documented for improved core performance and efficiency.

This device is aimed at design teams and system architects needing scalable programmable logic, substantial local memory, and broad I/O support for advanced custom hardware functions, prototyping, and high-throughput applications.

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