1SG280HH3F55E3VGS3

The 1SG280HH3F55E3VGS3 is a Stratix® 10 GX field programmable gate array (FPGA) in a 2912-BBGA FCBGA package designed for high-performance, bandwidth‑oriented applications. Built on the Stratix 10 family architecture, the device targets advanced applications that require large logic capacity, extensive on-chip memory, high-speed transceivers and system-level integration.

Its architecture and family-level innovations emphasize core performance, power efficiency and integrated hard IP to support demanding networking, compute and data‑processing functions while operating within a 0 °C to 100 °C temperature range and a 770 mV to 970 mV core supply window.

Key Features

• Logic Capacity — 2,800,000 logic elements providing large programmable fabric for complex algorithms and system functions; device-level count supports substantial gateware integration.
• Adaptive Logic Modules — 350,000 ALMs reported, enabling fine-grained mapping of logic and arithmetic functions across the fabric.
• On‑chip Memory — 240,123,904 total RAM bits for deep buffering, large lookup tables and embedded data structures without immediate external memory dependence.
• I/O and Package — 1,160 I/Os in a 2912-BBGA FCBGA surface-mount package (supplier package: 2912-FBGA, FC 55×55) for high-density board integration and extensive peripheral connectivity.
• High‑Performance Fabric — Stratix 10 family innovations such as the Intel Hyperflex core architecture and 14 nm FinFET process (family-level features) for improved core performance and power characteristics.
• Transceivers and Interfaces — Family-level heterogeneous 3D SiP transceiver tiles and high-speed transceiver capabilities (series documentation highlights high data‑rate transceivers and hard PCI Express and Ethernet IP options) to support protocol and backplane interfaces.
• DSP and Compute — Family-level variable precision DSP blocks and hard compute IP (including high-performance floating-point and fixed-point DSP) suitable for signal processing and acceleration tasks.
• Power & Configuration — Core voltage supply range from 770 mV to 970 mV; device configuration and secure device manager features are part of the Stratix 10 family architecture.
• Operating Range & Compliance — Extended grade device with operating temperature from 0 °C to 100 °C and RoHS compliant.

Typical Applications

• Data Center Acceleration — Large logic capacity, extensive on‑chip RAM and high-speed transceiver support make the device suitable for compute acceleration, packet processing and inline data transformation.
• Telecommunications & Networking — High-density I/O and family-level hard IP for PCI Express and Ethernet support enable deployment in switching, routing and backplane interface applications.
• High‑Performance Signal Processing — Variable precision DSP blocks and large memory resources support real-time signal processing, waveform generation and filtering tasks.
• System Prototyping & Integration — The combination of significant logic elements, embedded memory and broad I/O facilitates complex system prototypes and integrated platform designs.

Unique Advantages

• Substantial Logic and Memory Resources: 2,800,000 logic elements and 240,123,904 RAM bits provide a platform for large-scale FPGA designs and on-chip data handling.
• High I/O Density in a Compact Package: 1,160 I/Os in a 2912‑FBGA (55×55) package supports complex board-level connectivity while maintaining a surface-mount form factor.
• Family-Level High-Performance Architecture: Intel Stratix 10 innovations such as the Hyperflex core and 14 nm FinFET technology (as described in family documentation) contribute to improved core performance and energy efficiency.
• Ready for High‑Bandwidth Interfaces: Family documentation highlights advanced transceiver tiles and hard protocol IP (PCIe, Ethernet), enabling interface integration for demanding communications paths.
• Extended Temperature Grade & RoHS Compliance: Extended operating range (0 °C to 100 °C) and RoHS compliance support deployment in applications that require environmental tolerance without leaded components.

Why Choose 1SG280HH3F55E3VGS3?

The 1SG280HH3F55E3VGS3 delivers a combination of high logic capacity, extensive embedded memory and dense I/O in a FCBGA package, making it suitable for advanced designs that require significant on-chip resources and high-bandwidth interfacing. Its placement in the Stratix 10 GX family gives access to family-level architectural advantages aimed at improving core performance and power efficiency.

This device is well suited for engineering teams developing data center acceleration, high-performance networking, or compute-intensive signal processing systems that need scalable FPGA fabric and integrated system-level features. The extended-grade temperature range and RoHS compliance provide predictable operating parameters for deployment in a variety of commercial and telecom environments.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 1SG280HH3F55E3VGS3.