1SG280HH3F55I1VG

The 1SG280HH3F55I1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2912‑ball FCBGA package designed for high-performance, bandwidth‑demanding applications. As a member of the Stratix 10 GX family, it incorporates the Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology to address advanced processing and I/O requirements.

This device targets systems that require large programmable fabric and dense I/O — including data‑plane processing, high‑speed communications, and compute‑intensive tasks — while offering industrial temperature range and RoHS compliance for broad deployment scenarios.

Key Features

• Logic Capacity  2,800,000 logic elements and 350,000 configurable logic blocks (CLBs) to implement large, complex designs and high‑density custom datapaths.
• Embedded Memory  240,123,904 total RAM bits providing extensive on‑chip buffering and storage for high‑throughput designs.
• High‑Density I/O  1,160 I/O pins to support wide parallel interfaces, multi‑lane links, and extensive peripheral connectivity.
• Advanced Core Architecture  Implements the Intel Hyperflex core architecture announced for Stratix 10, delivering higher core performance for demanding logic and DSP tasks.
• Process Technology  Built on Intel 14 nm tri‑gate (FinFET) technology as described for the Stratix 10 family, enabling improved performance and power characteristics.
• High‑Speed Transceiver and IP Options  Family features include high‑performance transceivers and hard IP such as PCIe and 10G Ethernet (as described in the Stratix 10 GX device overview).
• Power and Voltage  Core supply range specified at 770 mV to 970 mV for integration with platform power rails.
• Package and Mounting  2912‑BBGA FCBGA (2912‑FBGA, FC 55×55) surface‑mount package for high‑density board designs.
• Temperature Grade  Industrial operating range from −40 °C to 100 °C for deployment in a wide set of environmental conditions.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑speed networking and telecom infrastructure  Large logic capacity and dense I/O enable implementation of packet processing, line cards, and multi‑lane transceiver systems.
• Data center and acceleration  On‑chip memory and extensive logic fabric support custom acceleration, packet inspection, and preprocessing workloads.
• High‑performance compute and signal processing  The Hyperflex core architecture and large resource set suit compute‑intensive DSP pipelines and realtime data processing.

Unique Advantages

• Scalable programmable fabric: 2.8M logic elements provide the headroom to consolidate complex functions into a single device, reducing system BOM and board count.
• Large on‑chip memory: 240Mbits of RAM reduce external memory dependence for buffering and intermediate data storage, simplifying board-level memory architectures.
• Dense connectivity: 1,160 I/Os and a 2912‑ball FCBGA package allow high‑pin‑count routing and support for wide parallel and serial interfaces.
• Industrial temperature support: −40 °C to 100 °C rating enables reliable operation across a broad set of deployed environments.
• Modern process and core architecture: Leveraging Intel 14 nm FinFET process and the Hyperflex architecture (Stratix 10 family) for enhanced performance-per-watt and core throughput.
• Compliance and manufacturability: RoHS compliance and surface‑mount FCBGA packaging align with modern production and environmental requirements.

Why Choose 1SG280HH3F55I1VG?

The 1SG280HH3F55I1VG positions itself where substantial programmable logic, abundant on‑chip RAM, and high I/O density are required in a single FPGA package. Its inclusion in the Stratix 10 GX family brings architecture and process advantages described for the family — enabling higher core performance and efficient power characteristics for advanced applications.

This device is suited to engineers and system designers building high‑bandwidth communications gear, data center accelerators, and compute‑intensive signal processing systems that need a large, industrial‑rated FPGA with dense connectivity and modern silicon architecture.

Request a quote or submit an inquiry to receive pricing, availability, and support details for the 1SG280HH3F55I1VG. Our team can assist with lead times, packaging options, and technical resources to help integrate this Stratix 10 GX device into your design.