1SG280HH3F55I2VG

The 1SG280HH3F55I2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 2912-ball FCBGA package for surface-mount applications. It is based on the Stratix 10 family architecture and leverages the Intel Hyperflex core innovations described for the series.

Designed for demanding, industrial-temperature applications, this device combines a large programmable fabric with high I/O density and on-chip RAM to address high-throughput compute, networking, and signal-processing use cases while operating across a wide supply and temperature range.

Key Features

• Core Architecture  Based on the Intel Stratix 10 family and Hyperflex core architecture as described in the device overview.
• Logic Capacity  2,800,000 logic elements (logic cells) for large-scale programmable logic implementations.
• On-Chip Memory  240,123,904 total RAM bits to support large buffering, lookup tables, and on-chip data storage.
• I/O Density  1,160 user I/Os to support high channel counts, wide parallel interfaces, and extensive peripheral connectivity.
• Power and Supply  Core voltage supply range of 770 mV to 970 mV to match system power-rail requirements for the device.
• Package & Mounting  2912-ball BBGA (FCBGA) package, 55 × 55 mm supplier package — surface-mount mounting type for board-level assembly.
• Operating Range  Industrial temperature grade: –40 °C to 100 °C for use in extended-temperature environments.
• Compliance  RoHS compliant.

Typical Applications

• High-speed networking and data center  High logic capacity and dense I/O support implementation of packet processing, switching, and protocol offload functions.
• Signal processing and DSP  Large on-chip RAM and abundant logic enable complex filtering, encoding/decoding, and real-time signal pipelines.
• High-bandwidth interfaces  High I/O count and series-level transceiver capabilities support multi-lane link aggregation and board-level high-speed connectivity.
• Embedded compute and SoC integration  Stratix 10 family architecture supports designs that combine programmable fabric with hard-IP system elements for embedded processing and control.

Unique Advantages

• Very large programmable fabric: 2.8 million logic elements enable consolidation of complex system functions onto a single device.
• Substantial on-chip memory: 240,123,904 RAM bits reduce external memory dependence and improve data throughput and latency for streaming applications.
• High I/O count: 1,160 I/Os allow extensive parallel interfacing and multi-channel system designs without external multiplexing.
• Industrial temperature rating: Specified –40 °C to 100 °C for reliable operation across harsh or extended-temperature deployments.
• Compact, assembly-ready package: 2912-BBGA (55 × 55 mm) surface-mount package supports high-density board layouts and standard PCB assembly flows.
• Standards-compliant manufacturing: RoHS compliance supports regulatory and environmental requirements for commercial and industrial products.

Why Choose 1SG280HH3F55I2VG?

The 1SG280HH3F55I2VG positions itself as a high-capacity Stratix 10 GX FPGA option for engineers who need large programmable resources, extensive on-chip memory, and dense I/O in an industrial-temperature device. Its combination of 2.8 million logic elements, over 240 million RAM bits, and 1,160 I/Os offers the building blocks for complex networking, DSP, and embedded compute systems.

Choose this device when your design requires scalable logic and memory on a single FPGA platform, broad I/O coverage for multi-channel interfaces, and operation across a wide temperature and supply range supported by a Stratix 10 family architecture.

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