1SG280HH3F55E3XG

The 1SG280HH3F55E3XG is an Intel Stratix® 10 GX FPGA providing high-density programmable logic and extensive on-chip memory for demanding bandwidth- and compute-intensive designs. Built on the Stratix 10 GX family architecture, it leverages the Intel Hyperflex core and advanced process technologies to deliver elevated core performance and energy efficiency for data- and signal-processing systems.

This device targets high-performance communications, networking, and compute applications that require large logic capacity, abundant embedded RAM, and extensive I/O. Key value comes from its combination of 2,800,000 logic elements, 240,123,904 total RAM bits, and 1,160 I/O pins in a 2912-BBGA package.

Key Features

• Core & Architecture  Intel Hyperflex core architecture and Stratix 10 family innovations deliver increased core performance and improved power efficiency as documented for the family.
• Logic Capacity  2,800,000 logic elements provide a very high level of programmable logic resources for complex logic, packet processing, and custom compute pipelines.
• On‑Chip Memory  240,123,904 total RAM bits of embedded memory support large buffering, lookup tables, and memory-intensive algorithms without immediate reliance on external DRAM.
• I/O & Transceiver Capability  1,160 I/O pins enable extensive board-level interfacing options. Family-level transceiver and high-speed I/O innovations are part of the Stratix 10 GX device overview.
• Voltage & Power  Core voltage supply range of 820 mV to 880 mV enables operation within the specified low-voltage core domain for this device.
• Package & Mounting  Supplied in a 2912-BBGA (FCBGA) package (2912-FBGA, FC 55×55 footprint) suitable for surface-mount assembly on high-density boards.
• Operating Range & Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C to match thermally constrained system environments.
• Standards & Compliance  RoHS compliant to support regulatory and environmental requirements for lead-free assemblies.

Typical Applications

• High‑Performance Networking  Packet processing and switching fabrics benefiting from large logic capacity and abundant on-chip RAM for buffering and stateful operations.
• Data Center & Acceleration  Compute acceleration, protocol offload, and custom data-path processing where high logic density and extensive I/O are required.
• High‑Speed Communications  Backplane, optical, and module-level interfaces that take advantage of the Stratix 10 GX family’s high-speed I/O and transceiver capabilities.
• Signal Processing & DSP  Wideband signal chains and real-time processing pipelines that need large embedded memory and dense logic resources.

Unique Advantages

• High Logic Density: 2,800,000 logic elements enable consolidation of complex functions into a single device, reducing board-level component count.
• Large Embedded Memory: 240,123,904 RAM bits provide significant on-chip storage for packet buffers, lookup tables, and streaming data without immediate external memory dependencies.
• Extensive I/O Count: 1,160 I/O pins support rich peripheral and protocol interfacing options, simplifying multi-lane and multi-protocol designs.
• Advanced Core Efficiency: Family-level Hyperflex core architecture improvements help deliver higher core performance and improved power characteristics versus earlier generations.
• Compact Surface‑Mount Package: 2912-BBGA FCBGA packaging in a 55×55 footprint balances routeability and thermal considerations for dense system boards.
• RoHS Compliance & Extended Grade: Environmentally compliant materials and extended-grade temperature range support a wide array of commercial and enterprise applications.

Why Choose 1SG280HH3F55E3XG?

The 1SG280HH3F55E3XG positions itself as a high-density, high-performance Stratix 10 GX FPGA option for designs demanding substantial programmable logic, large on-chip RAM, and broad I/O. Its combination of family-level architectural innovations and device-level capacity makes it well suited for networking, data-center acceleration, high-speed communications, and advanced signal-processing systems.

Designed for engineers and system architects who need scalable logic resources and integrated memory in a single-package FPGA, this device offers long-term design flexibility through high density, proven family features, and compliance with RoHS environmental standards.

Request a quote or submit a purchase inquiry to learn pricing, availability, and how the 1SG280HH3F55E3XG can meet your project requirements.