1SG280HH3F55E2VGS3

The 1SG280HH3F55E2VGS3 is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2912‑BBGA (FCBGA) package. It pairs a high logic density with large on‑chip RAM and a high I/O count to address advanced, high‑performance digital designs.

Built on the Stratix 10 GX family architecture, this device leverages Intel’s Hyperflex core concepts and 14 nm device innovations (as outlined for the Stratix 10 GX family) to deliver the performance and integration required for demanding compute, networking, and data‑processing applications.

Key Features

• Core Logic  2,800,000 logic elements for high‑density programmable logic and complex custom architectures.
• On‑Chip Memory  240,123,904 total RAM bits to support large buffering, lookup tables, and state storage without relying solely on external memory.
• I/O Capacity  1,160 user I/O pins to support wide parallel interfaces, multi‑lane SERDES routing, and dense system integration.
• Power and Supply  Core voltage supply range from 770 mV to 970 mV to match system power‑supply designs and regulator selections.
• Package and Mounting  2912‑BBGA (FCBGA) package, supplier device package listed as 2912‑FBGA, FC (55×55); surface‑mount mounting for PCB assembly.
• Operating Range and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for systems that require above‑ambient commercial operation.
• Environmental Compliance  RoHS‑compliant for regulatory and assembly process compatibility.

Typical Applications

• Data Center Acceleration  Programmable compute and logic offload where high logic density and large on‑chip memory accelerate packet processing and custom algorithms.
• Network & Telecommunications  High I/O count and Stratix 10 GX family transceiver capabilities enable multi‑lane backplane and line‑rate networking functions.
• High‑Performance Signal Processing  Large RAM capacity and dense logic resources support real‑time DSP, aggregation, and preprocessing workloads.
• Complex Prototyping and System Integration  Use as a platform for integrating wide parallel interfaces, custom peripherals, and system control logic in advanced prototypes.

Unique Advantages

• High Logic Density:  2.8 million logic elements provide the headroom to implement large, complex designs on a single device.
• Massive On‑Chip Memory:  Over 240 million bits of RAM reduce reliance on external memory for buffering and stateful processing.
• Extensive I/O Resources:  1,160 I/O pins enable dense interfacing to high‑speed modules, multi‑lane links, and wide parallel buses.
• Advanced Package and Mounting:  2912‑BBGA FCBGA in a 55×55 supplier package supports high‑density routing and thermal management on surface‑mount PCBs.
• Application‑Level Temperature Range:  Extended grade (0 °C to 100 °C) meets many commercial and enterprise system thermal requirements.
• Regulatory Readiness:  RoHS compliance simplifies environmental and manufacturing considerations.

Why Choose 1SG280HH3F55E2VGS3?

The 1SG280HH3F55E2VGS3 offers a balance of very high logic capacity, substantial on‑chip memory, and broad I/O resources in a single Stratix 10 GX FPGA package. Its extended temperature grade and RoHS compliance make it suitable for commercial and enterprise platforms that demand dense programmable logic, large local memory, and flexible system interfacing.

This device is well suited to designers and system integrators building advanced networking, data‑processing, and compute‑acceleration solutions who need a scalable, high‑density FPGA fabric supported by the Stratix 10 GX family architecture.

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