1SG280HH3F55E2LGS3

The 1SG280HH3F55E2LGS3 is a Stratix® 10 GX field programmable gate array (FPGA) IC from Intel, featuring a high-density fabric tailored for advanced, high-bandwidth applications. It pairs a large logic capacity with substantial embedded RAM and a high I/O count to address demanding processing and connectivity tasks.

Built on the Stratix 10 family architecture, the device is intended for designs that require large-scale programmable logic, significant on-chip memory, and extensive external interfacing while operating within an extended temperature range.

Key Features

• Logic Capacity  2,800,000 logic elements (LEs) specified for this device, providing large programmable fabric for complex designs.
• On-chip Memory  Total RAM bits: 240,123,904, enabling substantial embedded storage for buffers, FIFOs, and on-chip data structures.
• Input/Output  1,160 I/O pins to support high connectivity density for external interfaces, memory buses, and peripherals.
• Core Architecture (Family)  Stratix 10 family innovations include the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process, delivering enhanced core performance and efficiency as described in the device family documentation.
• Package & Mounting  2912-BBGA (FCBGA) package, supplier device package 2912-FBGA (55 × 55), surface-mount mounting for high-density board integration.
• Power Supply  Core voltage supply range: 820 mV to 880 mV for the device core.
• Operating Range & Grade  Extended grade device with an operating temperature range of 0°C to 100°C.
• Environmental  RoHS compliant.

Typical Applications

• High-bandwidth network and switch systems  Use the device’s large logic capacity and high I/O count to implement packet processing, traffic management, and complex protocol logic.
• Data center acceleration  Leverage extensive on-chip RAM and logic resources for hardware acceleration of compute and data-path workloads.
• High-performance signal processing  Deploy the FPGA fabric and large embedded memory for real-time DSP pipelines, buffering, and protocol handling.
• Advanced FPGA-based system prototypes  Ideal for developers requiring a high-density programmable platform to validate system architectures and integration approaches.

Unique Advantages

• Massive programmable fabric: 2.8 million logic elements enable complex, large-scale designs without immediate need for multi-FPGA partitioning.
• Large embedded memory: Over 240 million bits of on-chip RAM support deep buffering, table storage, and high-throughput data paths.
• High I/O density: 1,160 I/O pins facilitate wide external interfaces and flexible board-level connectivity options.
• Compact system footprint: 2912-BBGA FCBGA packaging and surface-mount mounting permit high-density PCB layouts in space-constrained systems.
• Extended-grade operation: Rated for 0°C to 100°C operation to meet a broad set of system thermal environments.
• Vendor-backed family innovations: As part of the Stratix 10 family, the device benefits from family-level architectural enhancements such as the Hyperflex core and 14 nm FinFET process described in the device documentation.

Why Choose 1SG280HH3F55E2LGS3?

This Stratix 10 GX device positions itself as a high-density, high-connectivity FPGA solution for designs that demand extensive programmable logic, significant on-chip memory, and broad external interfacing. Its combination of 2.8M logic elements, 240M+ RAM bits, and 1,160 I/Os makes it well suited to complex data-path, acceleration, and networking functions where integration and on-chip capacity matter.

Selected for systems requiring an extended-grade component in a 2912-BBGA package and a low-voltage core supply, the 1SG280HH3F55E2LGS3 offers a scalable platform backed by Stratix 10 family documentation and Intel device-level technologies.

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