1SG280HH2F55I2VG

The 1SG280HH2F55I2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2912-BBGA FCBGA package, offered in an industrial-grade temperature range. This device pairs very high logic capacity and on-chip RAM with an architecture designed for demanding, high-bandwidth and high-performance applications.

Built on the Stratix® 10 family innovations, the device benefits from the Intel Hyperflex™ core architecture and 14 nm tri-gate (FinFET) technology described in the product family documentation, delivering improved core efficiency and support for advanced transceiver, memory, and DSP capabilities.

Key Features

• Core and Architecture — Based on the Intel Stratix® 10 GX family and Hyperflex™ core architecture; family materials describe enhanced core performance enabled by Intel 14 nm tri-gate technology.
• Logic Capacity — 2,800,000 logic elements, providing large programmable fabric for complex designs.
• On‑Chip Memory — 240,123,904 total RAM bits available for large buffering, LUTRAM and state storage.
• I/O Count — 1,160 I/Os to support dense external connectivity and multi-channel interfaces.
• High‑Speed Transceivers (family capability) — Family documentation details heterogeneous 3D SiP transceiver tiles with up to 96 full‑duplex channels and transceiver data rates up to 28.3 Gbps for high-bandwidth links.
• Interfaces and Hard IP (family capability) — Family-level support includes hard PCI Express Gen3 x16 IP, hard memory controllers and PHYs supporting DDR4 rates up to 2666 Mbps per pin, and hardened 10G/40G Ethernet/FEC in transceivers.
• DSP and Compute (family capability) — Variable precision DSP block architecture described in the family materials to support high-throughput signal processing workloads.
• Package and Mounting — 2912‑BBGA (FCBGA) package; supplier device package listed as 2912‑FBGA, FC (55×55). Surface mount device.
• Power and Operating Range — Voltage supply range 770 mV to 970 mV; operating temperature range −40 °C to 100 °C.
• Environmental — RoHS compliant.

Typical Applications

• High‑performance networking and switching — Large logic capacity, high I/O count and family transceiver capabilities enable multi‑lane backplane and packet-processing designs.
• Data center acceleration — Significant on‑chip RAM and DSP fabric support custom acceleration of compute and data‑movement workloads.
• Telecommunications infrastructure — Industrial temperature rating and extensive I/O make the device suitable for line cards and transport equipment requiring high bandwidth.
• High‑speed test and measurement — Dense logic and high I/O facilitate real‑time signal capture, protocol analysis, and instrument control.

Unique Advantages

• Massive programmable fabric: 2,800,000 logic elements let you implement large, complex designs without partitioning across multiple devices.
• Substantial on‑chip memory: 240,123,904 total RAM bits reduce external memory dependence for buffering and stateful processing.
• High external connectivity: 1,160 I/Os provide flexibility to interface with a wide range of peripherals, transceivers, and memory devices.
• Industrial temperature capability: −40 °C to 100 °C rating supports deployment in thermally demanding environments.
• Robust package options: 2912‑BBGA (FCBGA) / 2912‑FBGA (55×55) package supports dense routing and high pin counts in surface‑mount assemblies.
• Family‑level high‑speed features: Stratix® 10 family innovations (Hyperflex core, FinFET process, high‑rate transceivers and hardened IP) provide scalable performance options for advanced system designs.

Why Choose 1SG280HH2F55I2VG?

The 1SG280HH2F55I2VG delivers a combination of very high logic density, large on‑chip RAM, and a high I/O count in an industrial‑rated FCBGA package, making it well suited for high‑bandwidth, compute‑intensive FPGA designs. Its alignment with the Stratix® 10 family architecture provides access to family-level transceiver, memory controller, and DSP capabilities documented for the series.

This part is appropriate for engineering teams and system integrators building advanced networking, data center acceleration, and telecom infrastructure equipment that require scalable programmable fabric, extensive connectivity, and industrial temperature operation.

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