1SG280HH2F55E2VGS3

The 1SG280HH2F55E2VGS3 is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 2912-BBGA FCBGA package. It delivers very high logic density and on-chip RAM to support advanced compute and high-bandwidth system designs.

Built on the Stratix 10 family architecture, this device targets demanding applications that require large numbers of logic elements, extensive embedded RAM, and a high I/O count while operating from a low core voltage.

Key Features

• Core Logic 2,800,000 logic elements enabling complex, high-density FPGA designs and large custom logic implementations.
• Embedded Memory 240,123,904 total RAM bits for on-chip buffering, state storage and large data structures without immediate external memory dependence.
• I/O Capacity 1,160 I/O pins to support wide parallel interfaces and multiple high-speed connections.
• Power and Voltage Core voltage supply range of 770 mV to 970 mV to match system power-rail planning and enable optimized core power delivery.
• Package and Mounting 2912-BBGA (FCBGA, 55×55) surface-mount package for high-density board integration and thermal accommodation.
• Operating Range Extended grade with an operational temperature range of 0 °C to 100 °C suitable for many commercial and telecom environments.
• Compliance RoHS compliant.
• Stratix 10 Family Innovations Family-level features include the Intel Hyperflex core architecture and Intel 14 nm tri-gate process, which are part of the Stratix 10 device series.

Typical Applications

• High-performance networking Use the device’s high logic density and large embedded RAM to implement packet processing, protocol acceleration, or switch/router functions requiring many I/Os.
• Data center compute acceleration Implement custom accelerators and offload engines that benefit from large logic resources and substantial on-chip memory.
• Telecommunications infrastructure Deploy in equipment that needs dense logic, large buffers, and many interfaces for baseband processing, fronthaul/backhaul aggregation, or line cards.
• High-speed connectivity modules Leverage the high I/O count for bridging multiple serial links, PHY interfaces, or complex multi-protocol I/O arrangements.

Unique Advantages

• High logic density: 2.8 million logic elements provide headroom for complex, multi-function designs without immediate partitioning across multiple devices.
• Large on-chip RAM: 240 million bits of embedded memory reduce dependency on external memory and improve deterministic data-path performance.
• Extensive I/O: 1,160 I/Os enable broad system interfacing and support for many parallel or serial front-ends.
• Compact system footprint: 2912-BBGA FCBGA package allows high integration on space-constrained PCBs while supporting thermal and routing needs.
• Low-voltage core operation: 770–970 mV supply range supports modern low-voltage power architectures for efficient core power delivery.
• Family-level innovations: Access to Stratix 10 series innovations such as the Hyperflex architecture and 14 nm process technology for advanced design opportunities.

Why Choose 1SG280HH2F55E2VGS3?

This Stratix 10 GX device is positioned for designs that require very high logic capacity, substantial on-chip memory, and a large number of I/Os in a single, surface-mount FCBGA package. The combination of 2.8 million logic elements, 240,123,904 RAM bits, and 1,160 I/Os makes it suitable for complex networking, compute acceleration, and telecom applications where integration and performance density matter.

As part of the Stratix 10 family, the device benefits from architecture and process innovations documented in the family overview, while providing specific, verifiable electrical and mechanical characteristics for system-level planning and procurement.

Request a quote or submit a product inquiry to receive pricing, availability, and technical support for 1SG280HH2F55E2VGS3.