1SG280HH2F55E2VG

The 1SG280HH2F55E2VG is a Stratix® 10 GX field programmable gate array (FPGA) in a 2912-BBGA FCBGA package, offering 2,800,000 logic elements and 1160 I/O pins. It is built on the Stratix 10 GX family architecture and leverages family-level innovations such as the Intel Hyperflex core architecture and the 14 nm device technology described in the device overview.

Designed for advanced applications that require high logic capacity, large on-chip memory, and extensive I/O, this extended-grade surface-mount device targets systems demanding high processing density and flexible I/O integration while operating within a 0 °C to 100 °C range.

Key Features

• Core Architecture  Based on the Intel Stratix 10 GX family with the Intel Hyperflex core architecture as described in the product overview.
• Logic Capacity  2,800,000 logic elements, suitable for large, complex FPGA designs.
• On-chip Memory  240,123,904 total RAM bits for extensive embedded memory resources and buffering.
• I/O and Packaging  1160 user I/Os in a 2912-BBGA (FCBGA) package; supplier device package listed as 2912-FBGA, FC (55×55). Surface mount mounting type.
• Power Supply  Supported core voltage supply range from 770 mV to 970 mV for core power planning and regulator selection.
• Operating Range & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance.
• Family-Level Capabilities  Leveraging Stratix 10 GX family features documented in the device overview — including high-performance core architecture and advanced transceiver/IP options — for scalable system design.

Typical Applications

• High-bandwidth communications  Large logic capacity and extensive I/O make this device suitable for network and backplane processing where complex protocol handling and buffering are required.
• Data center acceleration  High logic density and substantial on-chip RAM support compute acceleration and packet-processing tasks in data center appliances.
• SoC and embedded processing  Use in designs integrating programmable fabric with hard IP blocks from the Stratix 10 family to implement application-class processing pipelines.
• Memory interface controllers  Large RAM resources and abundant I/O enable implementation of high-performance external memory interfaces and buffering functions.

Unique Advantages

• Extensive logic resources: 2,800,000 logic elements provide headroom for large, complex designs without partitioning across multiple devices.
• Large on-chip RAM: 240,123,904 bits of RAM reduce external memory dependence for buffering, caching, and data-path implementations.
• High I/O count in compact package: 1160 I/Os in a 2912-BBGA (55×55) package simplifies board-level routing while offering dense connectivity.
• Power provisioning clarity: Defined core voltage range (770 mV–970 mV) enables precise power-supply design and thermal planning.
• Extended-grade qualification: Rated for 0 °C to 100 °C operation, suitable for systems designed around extended temperature environments.
• Family-level performance innovations: Benefiting from Stratix 10 GX family innovations such as the Hyperflex core architecture and 14 nm device technology documented in the device overview.

Why Choose 1SG280HH2F55E2VG?

The 1SG280HH2F55E2VG combines very large logic capacity, substantial on-chip memory, and a high I/O count in a single surface-mount 2912-BBGA package, making it a strong candidate for advanced designs that require dense programmable logic and extensive interfacing. Its extended-grade rating and specified core voltage range enable practical system integration for demanding applications operating within the provided temperature and power envelopes.

As a member of the Stratix 10 GX family, this device aligns with the family-level architecture and capabilities outlined in the device overview, providing designers with a scalable platform and access to the documented family features when building high-performance systems.

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