1SG280HH2F55E1VGS3

The 1SG280HH2F55E1VGS3 is an Intel Stratix® 10 GX field programmable gate array supplied in a 2912-ball FCBGA package. It combines a high logic capacity and large embedded memory with a broad I/O count to support demanding, high-bandwidth digital designs.

Designed for applications that require dense programmable logic, abundant on-chip RAM and extensive I/O, this device delivers a platform-level feature set intended for advanced communications, compute acceleration, and complex SoC designs.

Key Features

• Logic Capacity  2,800,000 logic elements supporting large-scale programmable designs and complex datapaths.
• Embedded Memory  240,123,904 total RAM bits to store large working sets, buffers and lookup tables on-chip.
• I/O  1,160 user I/Os for extensive external device connectivity and high-pin-count interfaces.
• Package & Mounting  2912-BBGA, FCBGA supplier device package (2912-FBGA, FC 55×55) with surface-mount assembly.
• Power Supply Range  Core voltage operation between 770 mV and 970 mV to match system power-rail designs.
• Operating Temperature  Specified for 0 °C to 100 °C operating temperature.
• Design Grade & Compliance  Extended grade device; RoHS compliant for environmental regulatory acceptance.
• Family Innovations (from Stratix® 10 GX Series)  Device family features include the Intel Hyperflex™ core architecture, Intel 14 nm tri-gate (FinFET) technology, heterogeneous 3D SiP transceiver tiles, multi-Gbps transceiver capabilities, and hard IP blocks such as PCIe and memory controllers as described in Stratix® 10 GX documentation.

Typical Applications

• High‑performance networking  Use in switches, routers and line cards where large logic capacity and abundant RAM enable packet processing, buffering and protocol offload.
• Data center acceleration  Suitable for FPGA-based accelerators that require dense programmable logic and extensive I/O for host and memory interfaces.
• High‑speed communications  Ideal for systems leveraging multi‑Gbps transceivers and wide I/O counts for backplane or module-level links.
• SoC and heterogeneous designs  Fits complex system designs that integrate programmable fabric with hard IP controllers and external memory subsystems.

Unique Advantages

• High logic density: 2.8M logic elements enable integration of large, complex functions on a single device and reduce external component count.
• Large on‑chip RAM: 240M+ bits of RAM reduce dependence on external memory for buffers and working datasets, improving latency and system-level performance.
• Extensive I/O: 1,160 I/Os provide flexibility to interface with multiple high‑speed peripherals and wide memory buses.
• Serializable package options: 2912-BBGA FCBGA footprint supports high-pin-count board designs and robust surface-mount assembly.
• Family-level performance innovations: Leverages Stratix® 10 GX family advancements such as the Hyperflex core and 14 nm FinFET process as documented for the series.
• Regulatory readiness: RoHS-compliant construction supports environmental regulatory requirements.

Why Choose 1SG280HH2F55E1VGS3?

The 1SG280HH2F55E1VGS3 positions itself as a high-capacity Stratix® 10 GX FPGA for designs that demand significant programmable logic, large embedded memory and a high I/O count in a 2912-ball FCBGA package. Its specified core voltage range and 0 °C–100 °C operating window make it suitable for extended‑grade applications where these electrical and thermal parameters align with system requirements.

For engineers developing advanced networking, compute acceleration or SoC-class FPGA designs, this device provides the on-chip resources and series‑level architectural innovations documented for the Stratix® 10 GX family to help consolidate functions and simplify board-level integration.

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