1SG280HH1F55I2LG

The 1SG280HH1F55I2LG is an Intel Stratix® 10 GX FPGA in a 2912-BBGA FCBGA package, offered as an industrial‑grade, surface‑mount programmable device. It combines high logic density, large embedded RAM, and extensive I/O capability to address demanding, high‑performance embedded and communications designs.

As part of the Stratix 10 GX family, this device benefits from the series innovations described in the Intel Stratix 10 overview—including the Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate (FinFET) technology—while delivering the specific, verifiable resources listed for this part.

Key Features

• High logic capacity — 2,800,000 logic elements to implement complex custom logic, packet processing, and algorithm acceleration.
• Large embedded memory — 240,123,904 total RAM bits for on‑chip buffering, lookup tables, and data staging.
• Extensive I/O — 1,160 user I/Os to support wide buses, multi‑lane interfaces, and dense system connectivity.
• Family innovations — Stratix 10 GX family-level technologies such as the Intel Hyperflex core architecture and Intel 14 nm tri‑gate process that inform device performance and efficiency.
• Package and mounting — 2912‑BBGA (2912‑FBGA, 55×55) package in a surface‑mount form factor suitable for modern PCB assembly.
• Low‑voltage core — Supply range of 820 mV to 880 mV consistent with modern low‑voltage FPGA core requirements.
• Industrial temperature range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Standards compliance — RoHS compliant.

Typical Applications

• High‑performance networking — Implements packet processing, switching, and protocol acceleration where high logic density and large on‑chip RAM are required.
• Data center acceleration — Supports custom compute and offload functions that leverage the device’s large logic and memory resources and broad I/O count.
• Telecommunications infrastructure — Enables multi‑lane interfaces and complex PHY/PCS implementations using the device’s extensive I/O and family transceiver capabilities described for Stratix 10 GX devices.
• Industrial control and automation — Industrial temperature rating and high integration make the part suitable for robust control, vision, and signal‑processing applications.

Unique Advantages

• High integration density: 2.8M logic elements reduce external logic and simplify board architecture for complex designs.
• On‑chip memory capacity: 240,123,904 RAM bits support deep buffering and large state machines without relying on external memory.
• Broad system connectivity: 1,160 I/Os enable large‑scale parallel interfaces, multi‑lane protocols, and flexible I/O assignment.
• Industrial readiness: −40 °C to 100 °C operating range supports deployment in demanding environmental conditions.
• Compact, production‑ready package: 2912‑BBGA FCBGA footprint and surface‑mount mounting facilitate integration into high‑density PCBs.
• Energy‑efficient core: Low core supply (820–880 mV) aligns with modern power budgets for high‑performance FPGA designs.

Why Choose 1SG280HH1F55I2LG?

The 1SG280HH1F55I2LG positions itself as a high‑density, industrial‑grade Stratix 10 GX FPGA that brings together large programmable resources, substantial on‑chip memory, and a high I/O count in a production‑ready BGA package. It is suited to designs that demand significant logic capacity and memory close to the fabric while operating across industrial temperature ranges.

Choose this device for scalable, performance‑oriented architectures where long‑term value is driven by on‑chip capacity, system connectivity, and the design leverage afforded by the Stratix 10 GX family technologies referenced in the device documentation.

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