1SG280HH1F55E2VGS3

The 1SG280HH1F55E2VGS3 is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2912-BBGA FCBGA package. It combines a high-density fabric with a large on-chip RAM footprint and extensive I/O to address high-bandwidth, compute-intensive system designs.

Built on family-level innovations such as the Intel Hyperflex core architecture and 14 nm tri-gate technology, the Stratix 10 GX family delivers substantially higher core performance and improved power efficiency versus prior generations, making this device suitable for networking, data acceleration and high-performance communications applications.

Key Features

• Logic Capacity — 2,800,000 logic elements, providing a large programmable fabric for complex functions and custom accelerators.
• On-Chip Memory — 240,123,904 total RAM bits, enabling large buffering, state storage and memory-intensive algorithms on-chip.
• I/O Density — 1,160 I/O pins to support wide parallel interfaces and numerous high-speed serial/parallel connections.
• Package & Mounting — 2912-BBGA, FCBGA (supplier package: 2912-FBGA, FC 55×55); surface-mount device suitable for compact board designs.
• Power and Operating Range — Core supply range 770 mV to 970 mV; operating temperature 0°C to 100°C; extended grade device.
• Family-Level Architecture — Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) process, delivering 2× core performance and up to 70% lower power versus the previous generation.
• High-Speed Transceivers — Family support for high-performance transceiver channels with data rates up to 28.3 Gbps for chip-to-chip/module and backplane links.
• Hard IP and DSP — Family-level integration includes hard PCI Express Gen3 x16 IP blocks, variable-precision DSP blocks and M20K internal SRAM memory block architecture for high-throughput signal processing.
• Standards and Compliance — RoHS compliant.

Typical Applications

• High-Speed Networking & Switching — Use the device’s high I/O count and high-speed transceivers to implement line-rate packet processing, switching fabric and backplane interfaces.
• Data Center Acceleration — Large logic capacity and substantial on-chip RAM support custom accelerators for encryption, compression, and data-path offload functions.
• Telecom & Optical Transport — High transceiver data rates and integrated hard IP simplify implementation of transport-layer functions and forward error correction.
• High-Performance Signal Processing — Variable-precision DSP resources and dense memory make the device suited for video processing, modulation/demodulation and real-time analytics.
• Test & Measurement Systems — The combination of large logic resources, high I/O density and predictable operating range supports complex instrumentation and protocol test platforms.

Unique Advantages

• Massive Programmable Fabric: 2,800,000 logic elements allow implementation of large custom functions and multiple co-designed accelerators on a single device.
• Extensive On-Chip Memory: 240,123,904 bits of RAM reduce external memory dependencies and lower system latency for buffering and streaming workloads.
• High I/O and Packaging Density: 1,160 I/O in a 2912-BBGA FCBGA package enables high-bandwidth board-level connectivity while conserving PCB area.
• Advanced Core Architecture: Hyperflex architecture and 14 nm FinFET process provide family-level performance and efficiency improvements for compute-heavy designs.
• Designed for High-Speed Links: Transceiver capability up to 28.3 Gbps and hard PCIe Gen3 x16 IP support modern interconnect and transport requirements.
• Extended Grade Reliability: Rated for operation from 0°C to 100°C, suitable for systems operating in controlled or enterprise environments.

Why Choose 1SG280HH1F55E2VGS3?

The 1SG280HH1F55E2VGS3 positions itself as a high-capacity Stratix 10 GX FPGA option for designs that require large programmable resources, significant on-chip RAM and extensive I/O bandwidth in a compact, surface-mount package. Its family-level innovations—Hyperflex core architecture, FinFET process, and high-speed transceiver support—translate into measurable performance and efficiency gains for demanding networking, compute acceleration and signal-processing applications.

This device is well suited to engineers building scalable, high-throughput systems who need a robust FPGA fabric combined with advanced hard IP and on-chip memory. The extended grade rating and RoHS compliance support deployment in enterprise and telecom equipment where those environmental and regulatory attributes are required.

Request a quote or submit a sales inquiry to receive pricing and availability information for 1SG280HH1F55E2VGS3 and to discuss how it can be integrated into your next high-performance FPGA design.