1SG280HH1F55E2LGAS

IC FPGA 1160 I/O 2912BGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 1160 2800000 2912-BBGA, FCBGA

Quantity 236 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2912-FBGA, FC (55x55)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2912-BBGA, FCBGANumber of I/O1160Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SG280HH1F55E2LGAS – Stratix® 10 GX FPGA, 2,800,000 logic elements, 1,160 I/Os, 2912‑BBGA

The Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) 1SG280HH1F55E2LGAS is a high-density programmable device designed for advanced bandwidth- and compute‑intensive systems. This extended‑grade, surface‑mount FCBGA package integrates 2,800,000 logic elements and 240,123,904 bits of on‑chip RAM to address large-scale digital processing and high‑throughput I/O tasks.

As a member of the Stratix 10 GX family, the device leverages the family’s Hyperflex core architecture and heterogeneous architecture innovations (as described in the device overview) to deliver scalable compute, rich memory, and high‑speed transceiver capabilities for demanding communications, data center, and accelerated processing applications.

Key Features

  • Logic Capacity  2,800,000 logic elements provide the programmable fabric to implement large, complex designs and deep RTL integration.
  • Embedded Memory  240,123,904 total RAM bits on‑chip to support buffering, packet processing, large lookup tables, and embedded data structures.
  • I/O Density  1,160 I/O pins enable extensive external interfacing for multi‑lane transceiver arrays, memory buses, and dense peripheral connectivity.
  • Package & Mounting  2912‑BBGA (FCBGA) supplier package, 2912‑FBGA, 55×55 footprint; optimized for surface‑mount assembly in high‑density systems.
  • Operating Range & Grade  Extended grade device specified for 0 °C to 100 °C operating temperature range to suit a broad set of deployed environments.
  • Supply Voltage  Core supply specified from 820 mV to 880 mV for the device core domains.
  • Standards & Compliance  RoHS compliant for environmental and manufacturing compatibility.
  • Family-Level Innovations  Stratix 10 GX family features cited in the device overview include the Intel Hyperflex core architecture, Intel 14 nm FinFET process, heterogeneous 3D SiP transceiver tiles, high‑speed transceivers, and hard IP options for PCI Express and Ethernet (family‑level features as published in the device overview).

Typical Applications

  • High‑Performance Networking  Dense I/O and family transceiver capabilities make this device suitable for switch, router, and backplane line card implementations requiring high bandwidth and sophisticated packet processing.
  • Data Center Acceleration  Large logic capacity and on‑chip RAM support FPGA‑based acceleration for compute and storage offload tasks where large custom pipelines are required.
  • Communications Infrastructure  The device’s I/O count and Stratix 10 family transceiver features are applicable to physical layer and protocol processing in telecom and optical interconnect equipment.
  • System Integration & Prototyping  High logic element count and extensive RAM make the device suitable for system validation, complex IP integration, and platform development.

Unique Advantages

  • Very high programmable capacity:  2,800,000 logic elements enable large RTL designs and dense IP integration without external logic partitioning.
  • Substantial on‑chip memory:  240,123,904 bits of internal RAM reduce dependence on external memory for buffering and stateful processing.
  • Large I/O footprint:  1,160 I/Os support extensive parallel interfaces, multi‑lane links, and mixed signaling needs in complex systems.
  • Production‑ready packaging:  2912‑BBGA FCBGA package and surface‑mount mounting are compatible with high‑density assembly flows.
  • Extended operating grade:  Specified for 0 °C to 100 °C, the device meets broader environmental ranges for many deployed applications.
  • Compliance and manufacturability:  RoHS compliance and standard FCBGA package dimensions support regulated manufacturing and supply chain integration.

Why Choose 1SG280HH1F55E2LGAS?

1SG280HH1F55E2LGAS combines very high logic density, extensive on‑chip RAM, and a large I/O complement in a single FCBGA device targeted at bandwidth‑ and compute‑heavy designs. As part of the Stratix 10 GX family, it aligns with the family’s architecture enhancements to support advanced transceiver and hard‑IP usage described in the device overview.

This device is appropriate for design teams and system integrators building scalable networking, data center acceleration, and communications infrastructure solutions that require substantial programmable resources, integrated memory, and high I/O counts while maintaining standard package and manufacturing compatibility.

If you need pricing, lead time, or availability information for 1SG280HH1F55E2LGAS, request a quote or submit a product inquiry to receive detailed procurement and technical assistance.

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