1SG280HH1F55E1VGS3

The 1SG280HH1F55E1VGS3 is an Intel Stratix® 10 GX Field Programmable Gate Array packaged in a 2912-BBGA (55 × 55 mm) format. Built on the Stratix 10 family architecture, this device combines a high logic capacity with large on-chip RAM and extensive I/O to address advanced, high-performance system designs.

Targeted at applications that require significant programmable logic, on-chip memory and high I/O density, the device delivers the family-level innovations of the Stratix 10 platform alongside part-specific capabilities such as 2,800,000 logic elements and 240,123,904 total RAM bits.

Key Features

• Logic Capacity — 2,800,000 logic elements to implement large, complex FPGA designs and high-density custom hardware functions.
• Configurable Logic Resources — High cluster count supports extensive parallelism for compute- and datapath-intensive designs.
• On-Chip Memory — 240,123,904 total RAM bits for large buffering, packet processing and working memory without external DRAM.
• I/O Density — 1,160 I/Os for broad external device connectivity and multi-channel interfacing.
• Supply Voltage — Core supply range from 770 mV to 970 mV, enabling integration into platforms using Stratix 10 family power profiles.
• Package and Mounting — 2912-BBGA (2912-FBGA, FC 55×55) surface-mount package designed for high-pin-count board layouts.
• Operating Range and Grade — Extended grade with an operating temperature range of 0 °C to 100 °C, suitable for demanding commercial and enterprise environments.
• Compliance — RoHS-compliant to support regulatory and manufacturing requirements.
• Family Innovations — Leverages Stratix 10 family technologies such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process, as described in the device family documentation.

Typical Applications

• High‑performance networking and telecommunications — Large logic capacity and high I/O count support packet processing, switching, and line card designs.
• Data center acceleration — Substantial on-chip RAM and programmable logic for custom accelerators, offload engines, and PCIe-based front-end processing.
• High-bandwidth test and measurement — Dense I/O and large logic resource pool enable complex capture, analysis and protocol handling in instrumentation systems.

Unique Advantages

• Large programmable fabric: 2.8M logic elements provide headroom for complex algorithms and wide parallelism without immediate need for multiple FPGAs.
• Significant on-chip memory: 240M+ RAM bits reduce reliance on external memory for buffering and stateful processing, simplifying board-level design.
• High I/O count: 1,160 I/Os enable direct interfacing to many high-speed peripherals and broad channel aggregation.
• Extended temperature grade: Qualified for 0 °C to 100 °C operation, aligning with many commercial and enterprise deployment environments.
• High-pin-count package: 2912-BBGA (55 × 55 mm) supports dense signal routing and compact system integration.
• Standards-friendly manufacturing: RoHS compliance eases inclusion in regulated product lines and modern manufacturing processes.

Why Choose 1SG280HH1F55E1VGS3?

This Stratix 10 GX device positions itself as a high-capacity FPGA option within the Stratix 10 family, combining millions of logic elements, expansive on-chip RAM, and a very high I/O count in a single 2912-BBGA package. It is suited for engineers and system designers building advanced networking, data center, and high-bandwidth instrumentation solutions who need large programmable resources and substantial memory without proliferating board-level components.

Choosing this part delivers scalability within the Stratix 10 platform and leverages family-level innovations documented for the series, while providing clear, verifiable part-level specifications for power, temperature, packaging and I/O that simplify system planning and procurement.

Request a quote or submit an inquiry for pricing and availability to get started with 1SG280HH1F55E1VGS3 in your next high-performance design.