1SG280HH1F55E2LGS3

The 1SG280HH1F55E2LGS3 is an Intel Stratix® 10 GX high-capacity field programmable gate array (FPGA) in a 2912-BBGA FCBGA package. It provides 2,800,000 logic elements and a large on-chip RAM budget for designs that require substantial programmable logic and memory density.

Built on the Stratix 10 family architecture, this device aligns with family-level innovations such as the Intel Hyperflex™ core architecture and Intel 14 nm FinFET process. It targets high-bandwidth, high-performance applications where logic capacity, I/O density, and power-efficient core operation are key design drivers.

Key Features

• Logic Capacity  2,800,000 logic elements to support large, complex designs and high-density logic implementations.
• On‑chip Memory  240,123,904 total RAM bits for embedded buffering, on-chip data storage, and memory-intensive functions.
• I/O Density  1,160 I/Os to accommodate wide interfaces, multiple high-pin-count peripherals, and extensive system connectivity.
• Power and Core Voltage  Core supply range specified at 820 mV to 880 mV for the device core domain.
• Package & Mounting  2912-BBGA FCBGA package (supplier device package listed as 2912-FBGA, FC 55×55) with surface-mount mounting for standard PCB assembly flows.
• Temperature & Grade  Extended grade device rated for 0 °C to 100 °C operating temperature.
• Standards & Compliance  RoHS compliant.
• Family-Level Innovations  Stratix 10 family features noted in the device overview include the Intel Hyperflex core architecture, Intel 14 nm tri-gate (FinFET) technology, heterogeneous 3D SiP transceiver tiles, high-speed transceivers, and hard IP blocks (family-level capabilities described in the Stratix 10 documentation).

Typical Applications

• High‑Performance Networking & Communications  Use the device’s logic and I/O density to implement packet processing, switch/aggregation logic, and custom protocol acceleration.
• Data Center Acceleration  Leverage large logic capacity and substantial on‑chip RAM for compute offload, custom accelerators, and data-path processing.
• Test & Measurement  High I/O count and logic density support complex signal processing, acquisition front-ends, and real-time analysis engines.
• Broadcast & Video Processing  On-chip memory and logic resources are suited for frame buffering, format conversion, and high-throughput media pipelines.

Unique Advantages

• High Logic and Memory Density: 2,800,000 logic elements and 240,123,904 bits of on-chip RAM enable implementation of large-scale designs without excessive external memory dependence.
• Extensive I/O Capability: 1,160 I/Os provide the pin count needed for multi-lane interfaces, wide data buses, and numerous peripheral connections.
• Compact, Production-Ready Package: 2912-BBGA (55×55) FCBGA surface-mount package supports standard PCB assembly and thermal management practices for high-density boards.
• Low-Voltage Core Operation: Core supply range of 820 mV to 880 mV supports designs targeting optimized core power domains.
• Extended Temperature Grade: Rated for 0 °C to 100 °C operation to meet a range of commercial and industrial ambient conditions.
• Regulatory Compliance: RoHS compliance facilitates integration into supply chains with hazardous-substance requirements.

Why Choose 1SG280HH1F55E2LGS3?

The 1SG280HH1F55E2LGS3 offers a compelling combination of very high logic capacity, substantial on-chip RAM, and dense I/O in a production-ready FCBGA package. It is positioned for designs that need large programmable fabrics and abundant local memory while maintaining a compact board footprint.

As part of the Stratix 10 GX family, this device aligns with documented family-level innovations—providing architecture continuity for teams that rely on the Stratix 10 device family documentation and ecosystem when developing high-performance, bandwidth‑focused systems.

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