1SG280HH1F55I1VG

IC FPGA 1160 I/O 2912BGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 1160 2800000 2912-BBGA, FCBGA

Quantity 1,370 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2912-FBGA, FC (55x55)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2912-BBGA, FCBGANumber of I/O1160Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SG280HH1F55I1VG – Stratix® 10 GX Field Programmable Gate Array (FPGA) IC

The 1SG280HH1F55I1VG is an Intel Stratix® 10 GX FPGA in a 2912‑BBGA (55 × 55 mm FCBGA) package, designed for high‑density, high‑performance logic integration. This industrial‑grade device delivers 2,800,000 logic elements, large on‑chip memory, and extensive I/O to address demanding bandwidth and processing use cases.

Built on the Stratix 10 GX family architecture, the device incorporates the family’s advanced core innovations and I/O capabilities to support applications that require significant programmable logic, high‑speed interfaces, and robust thermal and voltage operating ranges.

Key Features

  • Logic Capacity  2,800,000 logic elements (LEs) for large, complex FPGA designs and high integration density.
  • Embedded Memory  240,123,904 total RAM bits of on‑chip memory to support buffering, look‑up tables, and embedded data storage.
  • High I/O Count  1,160 I/O pins to connect wide buses, multiple interfaces, and large external subsystems.
  • Operating Range & Power  Core supply voltage range of 770 mV to 970 mV and an industrial operating temperature range of −40 °C to 100 °C for deployed systems.
  • Package  2912‑BBGA (2912‑FBGA, FC 55×55) surface‑mount package suitable for dense board integration.
  • Industrial Grade  Specified as industrial grade for use in commercial and industrial applications requiring extended temperature operation.
  • Compliance  RoHS compliant to meet standard environmental and manufacturing requirements.
  • Stratix 10 Family Innovations (device family)  Family features include the Intel Hyperflex core architecture, 14 nm FinFET process, heterogeneous 3D SiP transceiver tiles, high‑performance DSP and memory building blocks, and hard IP options described in the Stratix 10 GX/SX overview.

Typical Applications

  • High‑performance Networking: Implement packet processing, high‑speed switching, and line‑rate network functions using the device’s large logic capacity and extensive I/O.
  • Data Center Acceleration: Deploy custom accelerators and data‑path processing where large on‑chip memory and high logic density reduce external memory traffic and latency.
  • Telecommunications Infrastructure: Support backplane and module designs that require high channel counts and robust operating temperatures.
  • Advanced Signal Processing: Use embedded RAM and DSP‑oriented fabric (as defined in the Stratix 10 family) for high‑throughput digital signal algorithms.

Unique Advantages

  • High integration density: 2.8 million logic elements enable consolidation of complex subsystems onto a single FPGA, reducing board‑level component count.
  • Large on‑chip memory: 240,123,904 RAM bits provide significant internal storage for buffering, tables, and data processing close to logic.
  • Extensive connectivity: 1,160 I/Os support wide parallel interfaces, multiple peripherals, and flexible pin assignments for system integration.
  • Industrial temperature range: −40 °C to 100 °C rating supports deployments in harsh or temperature‑varying environments.
  • Robust package for dense boards: 2912‑BBGA (55 × 55 mm FCBGA) package enables high‑density PCB implementations while maintaining thermal and mechanical integrity.
  • Environmentally compliant: RoHS compliance assists in meeting regulatory and manufacturing requirements.

Why Choose 1SG280HH1F55I1VG?

The 1SG280HH1F55I1VG pairs the Stratix 10 GX family’s architectural strengths with device‑level capacity tuned for complex, bandwidth‑centric designs. With 2.8 million logic elements, substantial on‑chip RAM, and a high I/O count in an industrial‑grade FCBGA package, this FPGA is positioned for systems that demand large programmable logic resources, significant local memory, and robust environmental tolerance.

This device is suited to engineers and system architects designing high‑performance networking, communications, and compute acceleration solutions who need a scalable, high‑capacity programmable platform backed by the Stratix 10 family features and Intel documentation.

Request a quote or submit an inquiry to learn more about availability, pricing, and integration support for the 1SG280HH1F55I1VG.

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