1SG280HH2F55E1VG

The 1SG280HH2F55E1VG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 2912-BBGA FCBGA package. It combines a high logic element count with large on-chip RAM and extensive I/O to support demanding, high-bandwidth system designs.

Built around the Stratix 10 family architecture, the device targets applications that require high compute density, advanced signal processing and substantial I/O bandwidth while offering features from the device family such as the Intel Hyperflex core architecture and high-performance transceiver capabilities described in the device overview.

Key Features

• Core Architecture  Intel Stratix 10 family innovations including the Hyperflex core architecture for improved core performance (family-level feature described in the datasheet).
• Logic Capacity  2,800,000 logic elements, enabling large-scale, complex logic implementations.
• On‑Chip Memory  240,123,904 total RAM bits for buffering, packet processing and accelerator working memory.
• I/O and Package  1,160 I/O pins in a 2912‑BBGA (2912‑FBGA, FC 55×55) package, delivering broad external connectivity in a surface-mount footprint.
• Power  Core voltage supply range 770 mV to 970 mV to match system power-domain requirements.
• Operating Environment  Extended grade with an operating temperature range of 0°C to 100°C; RoHS compliant.
• Family-Level Interfaces and IP  Stratix 10 GX family features in the datasheet include high‑speed transceivers, hard PCIe and dedicated DSP capabilities (refer to family documentation for details).

Typical Applications

• High‑Performance Networking  Use for packet processing, switch infrastructure or line cards where large logic and extensive I/O support complex protocol and forwarding engines.
• Data Center Acceleration  Deploy as a hardware acceleration platform for compute- and memory-intensive workloads that benefit from dense logic and large on-chip RAM.
• High‑Throughput Signal Processing  Implement DSP pipelines and streaming data paths that require significant RAM and logic resources.
• System Integration and Prototyping  Integrate multiple high-speed interfaces and complex control logic within a single device for rapid development and consolidation of board-level functions.

Unique Advantages

• High logic density: 2.8 million logic elements allow integration of large, complex designs without partitioning across multiple devices.
• Substantial on‑chip memory: 240,123,904 bits of RAM reduce external memory bandwidth demands and simplify buffer architecture.
• Extensive external connectivity: 1,160 I/O pins in a compact 2912‑BBGA package provide flexible board-level interfacing options.
• Flexible power options: 770 mV–970 mV supply range supports a variety of system power architectures and scaling strategies.
• Extended temperature grade: Rated 0°C to 100°C for applications requiring extended operating range within that band.
• Family-level performance innovations: Leverages Stratix 10 GX family features such as the Hyperflex core architecture and high-speed transceiver technologies as documented in the device overview.

Why Choose 1SG280HH2F55E1VG?

The 1SG280HH2F55E1VG positions itself where high logic density, large on‑chip memory and broad I/O capacity are required in a single, surface‑mount FPGA package. Its Extended grade and defined power and temperature ranges make it suitable for demanding commercial and industrial-class designs that need deterministic thermal and electrical parameters.

Design teams building high-throughput networking, data center acceleration or advanced signal processing systems will find the device’s combination of logic resources, memory and I/O beneficial for consolidating functionality, reducing board complexity and accelerating time-to-market while relying on the Stratix 10 family feature set described in the device documentation.

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